HSHM-H115B4-CES50125-TG30L Allicdata Electronics
Allicdata Part #:

HSHM-H115B4-CES50125-TG30L-ND

Manufacturer Part#:

HSHM-H115B4-CES50125-TG30L

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: 3M
Short Description: CONN HEADER HSHM 115POS
More Detail: 115 Position Header, Male Pins Connector 0.079" (2...
DataSheet: HSHM-H115B4-CES50125-TG30L datasheetHSHM-H115B4-CES50125-TG30L Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: MetPak™ HSHM
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: --
Number of Positions: 115
Number of Positions Loaded: --
Pitch: 0.079" (2.00mm)
Number of Rows: --
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: Backplane
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1A
Voltage Rating: --
Operating Temperature: -55°C ~ 125°C
Features: --
Description

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Backplane connectors are an important part of the electronics industry. They are used to maintain connections between computer components on the motherboard and are the backbone of computer systems. The HSHM-H115B4-CES50125-TG30L is a backplane connector belonging to the Hard Metric family of products. This article will discuss the application field and working principle of the HSHM-H115B4-CES50125-TG30L backplane connector.

Hard Metric connectors are compact connectors that offer a much higher signal density and improved signal integrity than conventional connectors. Their compact design allows these products to be used in space-constrained applications where standard connectors are not an ideal solution. The HSHM-H115B4-CES50125-TG30L is an example of a Hard Metric product that is ideally suited for high-speed applications. It features a high-density pin configuration with a maximum working current of 5.5A. This makes it an ideal solution for applications where high-speed data transmission is required.

The HSHM-H115B4-CES50125-TG30L backplane connector is designed to be used in a wide range of applications. It is most commonly used in the medical, communication, industrial, aerospace, and military markets. It is also ideal for use in applications that involve high-speed communication or large amounts of data transmission. It is also extremely reliable and can withstand harsh environmental conditions such as extreme temperatures, vibration, moisture, and dust.

The HSHM-H115B4-CES50125-TG30L backplane connector is designed to provide reliable, high-speed connections between computer components. In addition to its high-speed and reliable performance, this backplane connector also offers high resistance to shock and vibration. This makes it an ideal choice for applications that require superior performance in harsh environments.

The working principle of the HSHM-H115B4-CES50125-TG30L backplane connector is based on the principle of power and signal transfer. This connector uses a contact system that allows electrical current and signals to be transmitted from one component to another. This contact system consists of an array of pins and sockets which are connected together through solder connection. The array of pins and sockets allow for the transmission of both power and data signals between different components.

The HSHM-H115B4-CES50125-TG30L backplane connector provides a high-speed, reliable connection between components in a wide range of applications. It is ideal for use in space-constrained applications and in applications that require high-speed data transmission or large amounts of data. This connector also provides excellent resistance to shock and vibration which makes it ideally suited for harsh environment applications. In summary, the HSHM-H115B4-CES50125-TG30L backplane connector is a reliable, high-performance product ideal for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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