Allicdata Part #: | HTSW-104-25-G-D-ND |
Manufacturer Part#: |
HTSW-104-25-G-D |
Price: | $ 0.69 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | .025'' SQ. TERMINAL STRIPS |
More Detail: | Connector Header Through Hole 8 position 0.100" (2... |
DataSheet: | HTSW-104-25-G-D Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 0.62370 |
Specifications
Operating Temperature: | -55°C ~ 125°C |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Finish - Post: | Gold |
Contact Material: | Phosphor Bronze |
Insulation Material: | Liquid Crystal Polymer (LCP) |
Features: | -- |
Overall Contact Length: | 0.630" (16.00mm) |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Natural |
Current Rating: | Varies by Wire Gauge |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | 3.00µin (0.076µm) |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 8 |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Series: | HTSW |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.320" (8.13mm) |
Contact Length - Post: | 0.210" (5.33mm) |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Applications and Working Principles of HTSW-104-25-G-D
HTSW-104-25-G-D is a high-tech device belonging to the Rectangular Connectors - Headers, Male Pins family of electrical components. It is used to connect electronic circuits within an electronic equipment or between two different pieces of equipment. It serves as the interface between two different circuits from the point of electronic signal flow.The HTSW-104-25-G-D comprises of a black anodized aluminum body which contains 104 contacts arranged in two rows of five columns which are recessed in the connector body. It is mated with a 50mil x 50mil ZIF (Zero Insertion Force) Socket. The contact of the HTSW-104-25-G-D are plated with gold plating to assure an optimal electrical connection between components.The HTSW-104-25-G-D provides a reliable connection that ensures signal integrity and conductivity in high-speed electronic applications. It is capable of operating at transfer speeds up to 10.3 Gbps and supports differential signals. Due to its high-density design, it provides the ability to reduce the overall size of an equipment’s printed circuit board.The HTSW-104-25-G-D is ideal for applications which need to transmit large amounts of data in a reliable and efficient manner. This includes applications such as interconnecting equipment within an integrated system, communications applications, remote device control, and digital test and measurement equipment.To ensure reliability and performance of the connection, the HTSW-104-25-G-D has a self-cleaning feature. This self-cleaning feature allows the contacts to be wiped and cleaned for a reliable connection between the two devices. The HTSW-104-25-G-D is RoHS compliant and is suitable for use in any application in which the environmental or electrical conditions require this designation. One of the major advantages of using the HTSW-104-25-G-D is its small size and light weight. The HTSW-104-25-G-D dimensions are only 0.77mm x 0.89mm and it weighs just 0.66grams. This makes it well suited for applications where space is at a premium, and where a lightweight connector with a high number of contacts is required.Overall, the working principle of the HTSW-104-25-G-D is quite simple. It is used to connect two different circuits electronically. It has 104 contacts which are gold plated for optimum conductivity, and is capable of handling transfer speeds up to 10.3 Gbps. It also has a self-cleaning feature, making it suitable for use in any application which requires reliable connection and high speed performance. It is well suited for applications which require maximum signal integrity in a small amount of space, such as telecommunications and digital measurements.The specific data is subject to PDF, and the above content is for reference
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