HTSW-120-08-G-D-LA Allicdata Electronics
Allicdata Part #:

HTSW-120-08-G-D-LA-ND

Manufacturer Part#:

HTSW-120-08-G-D-LA

Price: $ 3.21
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .025'' SQ. TERMINAL STRIPS
More Detail: Connector Header Through Hole, Right Angle 40 posi...
DataSheet: HTSW-120-08-G-D-LA datasheetHTSW-120-08-G-D-LA Datasheet/PDF
Quantity: 1000
1 +: $ 2.88540
Stock 1000Can Ship Immediately
$ 3.21
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.240" (6.10mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: --
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Current Rating: Varies by Wire Gauge
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: 3.00µin (0.076µm)
Applications: --
Number of Positions Loaded: All
Packaging: Bulk 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 40
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Series: HTSW
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Through Hole, Right Angle
Termination: Kinked Pin, Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.230" (5.84mm)
Contact Length - Post: 0.090" (2.29mm)
Description

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Introduction: The HTSW-120-08-G-D-LA is a rectangular connector made by Hirose Electric Co Ltd. It is designed for easy connection with other electronic components and provides robust electrical connections. The HTSW-120-08-G-D-LA allows for power, ground and signal connections in one compact connector. It is compatible with industry standard wire sizes from AWG#18 to AWG#22. The HTSW-120-08-G-D-LA has a robust housing and is suitable for a wide range of applications, including automotive, security, HVAC, industrial, medical, and consumer electronics.

Application Fields: The HTSW-120-08-G-D-LA is a versatile connector ideal for a variety of applications. It is suitable for high-frequency transmission in very tight spaces and is compatible with data rates up to 5Gbps. It also can be used in applications that require rugged construction and reliable connections, such as automotive, industrial, and HVAC systems. Additionally, the HTSW-120-08-G-D-LA is suitable for applications that require high EMI shielding, such as communications and consumer electronics.

Working Principle: The HTSW-120-08-G-D-LA is a two-piece interface consisting of a male pin and a female socket. The male pin has two spring-loaded pins that are designed to make contact with the female socket, which is also made up of two spring-loaded pins. The male pin and female socket have a latching mechanism that locks the two parts together for a secure connection. The male pin has a gold-plated finish that ensures a strong contact and provides EMI shielding. The female socket has a zinc-nickel finish that provides corrosion and mechanical protection.

Features: The HTSW-120-08-G-D-LA has various features that make it suitable for a variety of applications. It is designed for easy installation and features a latching mechanism for secure connections. The male pin and female socket are designed with zinc-nickel plated pins for corrosion protection and mechanical stability. The HTSW-120-08-G-D-LA is also designed with a robust housing and integrated EMI shielding. This combination of features ensures that the connector is secure, reliable, and low noise.

Conclusion: The HTSW-120-08-G-D-LA is a robust rectangular connector designed for a variety of applications. It has a latching mechanism for secure connections and is compatible with industry standard wire sizes. The HTSW-120-08-G-D-LA has gold-plated pins for efficient frequency transmission and zinc-nickel plated pins for corrosion and mechanical protection. Additionally, the connector has a robust housing and integrated EMI shielding for high-performance applications.

The specific data is subject to PDF, and the above content is for reference

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