
Allicdata Part #: | HTSW-125-27-G-T-ND |
Manufacturer Part#: |
HTSW-125-27-G-T |
Price: | $ 7.89 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | .025'' SQ. TERMINAL STRIPS |
More Detail: | Connector Header Through Hole 75 position 0.100" (... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 7.10010 |
Operating Temperature: | -55°C ~ 125°C |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Finish - Post: | Gold |
Contact Material: | Phosphor Bronze |
Insulation Material: | Liquid Crystal Polymer (LCP) |
Features: | -- |
Overall Contact Length: | 1.330" (33.78mm) |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Natural |
Current Rating: | Varies by Wire Gauge |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | 3.00µin (0.076µm) |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 75 |
Number of Rows: | 3 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Series: | HTSW |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.230" (5.84mm) |
Contact Length - Post: | 1.000" (25.40mm) |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The HTSW-125-27-G-T header is a cost-effective rectangular connector designed for a variety of applications. It is a single row rectangular interconnect solution with pre-assembled gable-top housings. The HTSW-125-27-G-T header provides reliable electrical and mechanical connection and secure environmental sealing for increased reliability and reduced system costs. The HTSW-125-27-G-T header is part of a larger product line consisting of a variety of connectors in different configurations.
The HTSW-125-27-G-T header is a single-row housing with an integrated, spring-loaded latch and horizontal polarizing key. The right angle space saving design allows for easy mounting on a variety of surfaces. The header is designed to mate with high-density headers in the Optimized Interconnect System (OIS), and it can be used in applications where standard connectors provide insufficient mating distances.
The unique design and operation of the HTSW-125-27-G-T header delivers a reliable, low profile interconnect with a simple mating interface. The housing features mating retention features for secure connections, a pre-assembled gable-top to protect against foreign objects and moisture, and a patented integrated shock-absorbing latch to ensure an optimal amount of engagement force. The gable-top also provides strain relief and guards against electrical shorts.
The HTSW-125-27-G-T header features a high-thrust pin configuration that minimizes contact disengagement. The contact pins are gold-plated and offer low contact resistance and low insertion and extraction forces. The header is rated for signal contacts up to 1 amp, and the housing is designed to withstand temperatures from -25°C to +85°C.
The HTSW-125-27-G-T header is designed for use in a variety of applications, including automotive, HVAC, instrumentation and medical. It is an ideal solution for applications that require compact solutions that provide reliable electrical and mechanical connections. It is also suitable for applications that require a fast, low-cost, and easy-to-use interconnect solution.
The HTSW-125-27-G-T header provides a reliable, safe, and cost-effective solution for interconnects in a variety of applications. The integrated spring-loaded latch, high-thrust pin configuration, and pre-assembled gable-top provide secure connections with low insertion and extraction forces. The header is also designed to withstand extreme temperatures and provide increased reliability with reduced system costs.
The specific data is subject to PDF, and the above content is for reference
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