
Allicdata Part #: | HTSW-128-23-S-D-ND |
Manufacturer Part#: |
HTSW-128-23-S-D |
Price: | $ 5.09 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | .025'' SQ. TERMINAL STRIPS |
More Detail: | Connector Header Through Hole 56 position 0.100" (... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 4.58010 |
Operating Temperature: | -55°C ~ 125°C |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Post: | Tin |
Contact Material: | Phosphor Bronze |
Insulation Material: | Liquid Crystal Polymer (LCP) |
Features: | -- |
Overall Contact Length: | 0.445" (11.30mm) |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Natural |
Current Rating: | Varies by Wire Gauge |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | -- |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 56 |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Series: | HTSW |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.230" (5.84mm) |
Contact Length - Post: | 0.115" (2.92mm) |
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The HTSW-128-23-S-D is a type of rectangular connector with a male pin design, used by a variety of industries around the world. This type of connector has a wide range of applications, primarily focused on high-reliability and embedded applications that must meet stringent design and cost requirements.
What Is the HTSW-128-23-S-D?
The HTSW-128-23-S-D is an industry-standard rectangular connector with a male pin design. The connector is based on a robust, high-temperature assembly, and is typically used for electronic applications requiring high-reliability and durability. It is designed for use in a variety of extreme environmental conditions, and is certified to Mil-STD-810F, MIL-STD-461E, and SAE-J-1455, among other standards.
Application Fields for the HTSW-128-23-S-D
The HTSW-128-23-S-D has a wide range of applications, primarily focused on embedded and high-reliability applications. It can be used in aerospace, aviation, military, medical, industrial, automotive, automation, and security applications. The connector is designed for reliable interconnections in a variety of harsh environments, ranging from extreme temperature shocks to exposure to corrosive elements. The HTSW-128-23-S-D is also suitable for use in vibration-prone environments, ensuring reliable connections even when exposed to major vibration.
Working Principle of the HTSW-128-23-S-D
The HTSW-128-23-S-D connector is based on a robust high-temperature assembly, with resilient and reliable seals surrounding the contacts. The connector utilizes a unique triple-seal system, which provides superior mechanical and environmental protection. The contact segments are structured to provide superior electrical connection between the two parts. This is done by compression of the contact segments by the mating forces of the two parts. The pins of the HTSW-128-23-S-D connector are made of gold-plated stainless steel, with a plating thickness of 2μm, or 0.00002 cm. The contact is highly reliable and ensures the efficient transfer of electrical current.
Conclusion
The HTSW-128-23-S-D is a robust rectangular connector with a male pin design, which is primarily used in high-reliability and embedded applications. Its triple-seal system provides superior protection against environmental hazards and vibration, and the gold-plated contact pins ensure efficient electrical connections. The connector is certified to a variety of standards, ensuring reliable performance in a variety of extreme environments. It is suitable for a variety of industrial, medical, automotive, and aviation applications.
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