Allicdata Part #: | HTSW-130-26-S-T-ND |
Manufacturer Part#: |
HTSW-130-26-S-T |
Price: | $ 11.29 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | .025'' SQ. TERMINAL STRIPS |
More Detail: | Connector Header Through Hole 90 position 0.100" (... |
DataSheet: | HTSW-130-26-S-T Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 10.16190 |
Operating Temperature: | -55°C ~ 125°C |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Post: | Tin |
Contact Material: | Phosphor Bronze |
Insulation Material: | Liquid Crystal Polymer (LCP) |
Features: | -- |
Overall Contact Length: | 0.456" (11.58mm) |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Natural |
Current Rating: | Varies by Wire Gauge |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | -- |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 90 |
Number of Rows: | 3 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Series: | HTSW |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.230" (5.84mm) |
Contact Length - Post: | 0.126" (3.20mm) |
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The HTSW-130-26-S-T rectangular connector is a reliable and durable single-row board-to-board connection device designed for use in a range of electronic systems. The HTSW-130-26-S-T offers a cost-effective solution that can greatly reduce assembly costs and are suitable for a variety of applications including telecommunications, instrumentation, consumer electronics, and industrial automation. The HTSW-130-26-S-T consists of two specified components, headers and male pins, that are applied in a board-to-board connection.
HTSW-130-26-S-T Headers are pins attached to the base of the connector that make contact when connected to a device. The headers are designed for direct soldering onto the printed circuit board. The headers are precision-molded from high-temperature thermoplastic and feature a flange and mounting ears that fit flush against the printed circuit board. These headers provide a clean and reliable connection that eliminates the need for cumbersome cables and solder connections.
The HTSW-130-26-S-T Male Pin, which is designed for direct soldering to the printed circuit board, is also precision-molded from high-temperature thermoplastic. The male pin is specially designed to fit into the header for a tight connection. The male pins are plated with either brass, nickel, or gold to provide enhanced corrosion resistance and improved electrical contact.
The HTSW-130-26-S-T headers and male pins are designed with a pitch of 2.54mm, which is the universal spacing for circuit boards. This ensures that the headers and male pins will mate perfectly with any circuit board made to this standard spacing, regardless of brand or type. The headers and male pins are also designed with a 0.65mm square pitch, which allows them to be mated easily and securely. The headers and male pins are also designed to withstand temperatures up to 125°C, which makes them suitable for use in a variety of applications.
The HTSW-130-26-S-T rectangular connector is an ideal choice for applications that demand reliable board-to-board connections. Its low-cost, easy-to-use design and ability to accommodate a range of circuit board spacing makes it a preferred choice for a variety of applications. The headers and male pins are designed for maximum performance and unbeatable reliability, and their high temperature resistance ensures they can be used in the most demanding environments. For those seeking a reliable, cost-effective board-to-board connection solution, the HTSW-130-26-S-T is the ideal choice.
The specific data is subject to PDF, and the above content is for reference
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