HTSW-220-09-G-Q-RA

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The HTSW-220-09-G-Q-RA is a type of rectangular connector specifically designed for headers, male pins, and other such applications. This connector is primarily used to enable the easy and fast connection of multiple electronic components to a printed circuit board. It is ideal for applications that require high connector density such as telecommunications, consumer electronics, automotive, and industrial applications.

The HTSW-220-09-G-Q-RA has a 2.00mm pitch and 8 circuit channels and comes with a long-life steel insert. It is made of high-quality, high-temperature thermoplastic that can withstand temperatures up to 125°C. This connector is also constructed with a smooth-operating locking system that offers secure contact retention. This makes it ideal for applications such as computers, peripherals, and data communications.

The most important feature of the HTSW-220-09-G-Q-RA is its high contact density. The connector accommodates up to 8 circuits in a confined space, allowing for high-density applications. This makes it a great option for applications where space is limited, such as in the automotive industry. The connector also allows for the quick and easy swapping of components, making it a great choice for prototyping applications.

In terms of its working principle, the HTSW-220-09-G-Q-RA connector works with a simple, four-step process. First, the user inserts the connector into the PCB. Then, the connector is placed in the correct orientation and is fixed in place with fasteners. Once secure, the user can then push the wires into the sockets in the connector. Finally, the connector’s locking system ensures that the wires are held securely and that the connection will last.

The HTSW-220-09-G-Q-RA is a great choice for applications that require high density headers, male pins, and other such components. It is designed with a long life steel insert for secure contact retention, while its thermoplastic construction ensures reliability and durability. The connector’s four-step installation process makes it a great choice for prototyping applications, while its high contact density makes it the perfect choice for applications where space is limited.

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