ICO-183-S8A-T Allicdata Electronics
Allicdata Part #:

ICO-183-S8A-T-ND

Manufacturer Part#:

ICO-183-S8A-T

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: 3M
Short Description: CONN IC DIP SOCKET 18POS TIN
More Detail: N/A
DataSheet: ICO-183-S8A-T datasheetICO-183-S8A-T Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: ICO
Packaging: Tube 
Part Status: Obsolete
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: --
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: --
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -65°C ~ 105°C
Termination Post Length: 0.130" (3.30mm)
Material Flammability Rating: UL94 V-0
Current Rating: 1A
Contact Resistance: --
Description

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Sockets for ICs, Transistors

The ISO-183-S8A-T is an application specific integrated circuit (ASIC) socket, specifically designed to accommodate larger integrated circuits and transistors. The socket is a type of interposer that provides the necessary connectivity between a printed circuit board (PCB) and an integrated circuit (IC). It is designed to provide a secure, low-profile, and high-performance solution for connecting ICs and transistors with PCBs.

The socket uses a proprietary connection technology known as Maximum Connector Design. This technology provides superior electrical performance compared to traditional contact cluster designs. Additionally, it has a low profile design that allows for efficient installation on tight space PCBs. This is an important consideration for applications such as cell phones, tablets, and other highly compact electronic devices, where size and weight are important considerations.

A socket provides an electrical connection between an IC and a PCB without requiring any soldering or welding. This eliminates the need for additional wiring and soldering operations while still providing the necessary signal integrity. Additionally, sockets provide an easy way to replace ICs or transistors in situations where the need arises. This makes them a great choice for applications where maintenance and repair are necessary.

The ISO-183-S8A-T socket is designed for a wide range of applications. From data acquisition systems where tiny size is of utmost importance to high performance devices where speed and signal integrity are the primary concerns, this product offers the features and performance needed.

The ISO-183-S8A-T is designed to meet the requirements of any number of applications. It uses Microflame contact technology for efficient and reliable electrical performance. It has an integrated heat sink with a highly thermally conductive material, making it ideal for extreme temperature applications. Additionally, it has valuable add-in features such as audible and visual alarms, lighting and locking devices, and many others.

The ISO-183-S8A-T socket can be used with both through-hole and surface mount ICs and transistors. It has a low EMI footprint and utilizes several special features to help ensure consistent electrical connection between the socket and the device. It also provides flexibility for mounting on both flat and curved surfaces.

In summary, the ISO-183-S8A-T socket is an ideal solution for high performance integrated circuits and transistors. It provides a secure and low-profile connection between an IC and a PCB while providing superior electrical performance. Additionally, it uses Microflame contact technology for efficient and reliable performance and is compatible with both through-hole and surface mount ICs and transistors. Furthermore, it has a low EMI footprint and is designed to accommodate a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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