IT3-300P-30H(03)

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The IT3-300P-30H(03) edge type mezzanine (board to board) connector from Sunkye is a ideal solution for providing high density interconnectivity in a wide variety of applications. It features a 3.00mm pitch, dual row, and 30-circuits with two mounting holes for easy integration. Compared to the traditional IDC (insulation displacement contact) connectors, the IT3-300P-30H(03) is smaller, lighter, and provides excellent EMI shielding.

The IT3-300P-30H(03) is designed for use in a variety of energy efficient electronic systems, such as home appliances, medical devices, consumer electronics, and automation & instrumentation. It is engineered with two built-in metal shield layers on its longitudinal sides, providing top-notch protection against unwanted electromagnetic interference (EMI). The connector is also designed for consistent, reliable performance in a wide temperature range between -40°C and +105°C.

The IT3-300P-30H(03) utilizes a pitch post feature for blind mating capability. The connection is closed when the connector is fully mated, and the guide keys prevent mis-mating - ensuring a secure fit every time. Its modules also have wide tie bars to accommodate a large range of cable diameters. For added reliability, the connector is designed to withstand up to 500 mating and un-mating cycles.

The movement of two spring beams inside the IT3-300P-30H(03) allows a positive central contact between the male and female connectors. This contact creates a low-resistance ground path and removes the need for a ground strap between mating connectors. With its 30-circuits, the IT3-300P-30H(03) offers higher density I/O connections than other similar products on the market.

Sunkye\'s IT3-300P-30H(03) mezzanine connector is an efficient, reliable solution for a wide variety of applications. With its two built-in EMI shielding layers, centralized ground contact, pitch post feature and 500 mating cycles, theIT3-300P-30H(03) provides consistent and reliable performance across a variety of temperature ranges. Its 30-circuits also offer higher levels of I/O connections than traditional IDC connectors, making it an ideal choice for high-density applications.

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