LQG15HS47NH02D

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Reflow soldering conditions

   1. Inductance value may be changed a little due to the amount of solder.So, the chip coil shall be soldered by reflow so that the solder volume can be controlled.

   2. Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.

   3. Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality.

   4. Reflow soldering profile 

Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Application restrictions

Please contact the manufacturer before using our products in the following particularly demanding applications Reliability to prevent defects that may directly damage the life, body or body of a third party Attributes.

    (1) Aircraft equipment

    (2) Aerospace equipment

    (3) Subsea equipment

    (4) Power plant control equipment

    (5) Medical equipment

    (6) Transportation equipment (vehicles, trains, ships, etc.)

    (7) Traffic signal equipment

    (8) Disaster prevention/crime prevention equipment

    (9) Data processing equipment

  (10) Applications with similar complexity and/or reliability Application requirements listed above

Appearance and Dimensions

Appearance and Dimensions of paper tape (8mm-wide)