LS2-105-01-S-D Allicdata Electronics
Allicdata Part #:

SAM10602-ND

Manufacturer Part#:

LS2-105-01-S-D

Price: $ 4.91
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: CONN HERMAPHRODITIC 10POS T/H
More Detail: 10 Position Connector Self Mating, Non-Gendered Th...
DataSheet: LS2-105-01-S-D datasheetLS2-105-01-S-D Datasheet/PDF
Quantity: 558
1 +: $ 4.41630
49 +: $ 3.86319
147 +: $ 3.49526
539 +: $ 2.94336
1029 +: $ 2.57544
Stock 558Can Ship Immediately
$ 4.91
Specifications
Series: LS2
Packaging: Tube 
Part Status: Active
Connector Type: Self Mating, Non-Gendered
Number of Positions: 10
Pitch: 0.079" (2.00mm)
Number of Rows: 2
Mounting Type: Through Hole
Features: Latch Holder
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: --
Height Above Board: 0.250" (6.35mm)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The LS2-105-01-S-D rectangular connector is an array, edge type mezzanine connector for board-to-board applications. It is designed to provide reliable electrical connections between two printed circuit boards, such as motherboards and daughtercards. It features a quick and simple two-step installation process for maximum convenience, a lower profile for a more streamlined look, and high-performance dual-path redundant contacts for superior signal transmission.

The LS2-105-01-S-D rectangular connector boasts a high signal integrity with low signal crosstalk, making it an ideal choice for high-speed applications. It is rated for up to 5A, and offers both vertical and horizontal connection options for maximum flexibility. The low-profile design reduces the connector’s footprint on the PCB, allowing for a more compact system with more space available for other components. Additionally, the Low Profile height makes standard board-to-board offset minimization possible.

The LS2-105-01-S-D rectangular connector has a polarized design with dual positive-locking tabs, ensuring secure assembly without any accidental disconnects. The dual-contact design also ensures superior signal paths, as each of the contacts is in direct contact with the contact point so that electrical signals are transmitted quickly. Additionally, the connector features backplane interconnects that minimizes skew and keep signal integrity at optimal levels. It is also IP67-rated for excellent dust and water-resistance.

The LS2-105-01-S-D rectangular connector works by providing electrical connections between two printed circuit boards. The connector consists of two parts – the upper board which contains the contacts and the lower board which houses the contact pins. When the two boards are connected, the contacts make a direct electrical contact with the contact pins, allowing electrical signals to pass through. The contacts also offer a secure connection by engaging the contact pins with a positive locking feature, preventing any accidental disconnection and ensuring consistent signal transmission.

A variety of different mounting options are available for the LS2-105-01-S-D rectangular connector. It can be surface-mounted onto the PCB, or mounted in a through-hole. The connector is also compatible with a wide range of circuit board OEMs and designers, making it suitable for a range of applications. Additionally, it features an even lower profile than other mezzanine connectors, making it an ideal choice for applications where space is at a premium.

In conclusion, the LS2-105-01-S-D rectangular connector is an ideal choice for board-to-board applications where high signal integrity and a low-profile design are required. It features a quick and simple two-step installation process, a dual-path redundant contact design, and a variety of mounting options, for maximum convenience and flexibility. Additionally, it has an IP67-rated shell for excellent dust and water-resistance and is compatible with a wide range of OEMs and PCB designers. It is the perfect choice for applications where space and signal integrity are both key concerns.

The specific data is subject to PDF, and the above content is for reference

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