LSS-110-03-F-DV-A

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LSS-110-03-F-DV-A is a type of mezzanine (board-to-board) rectangular connector Arrays. It features a two piece, modular design with two vertical and two horizontal modular array terminals. This type of connectors are used for high speed, high frequency, and high contact density applications. The technology used is Surface Mounted Technology (SMT).

The application field for the LSS-110-03-F-DV-A rectangular connector Array is very wide. It is used in a variety of applications in different areas such as medicine, electronics, telecommunications, and automotive. It can be found in many medical applications such as medical imaging, ultrasound, and patient monitoring. In the field of electronics, this type of connector array is often used for high speed signal transmission, daughterboard to daughterboard interconnection, and flexible PCB assembly. In telecommunications, it is most commonly used for high-speed digital video and audio transmission, as well as impedance-controlled transmission and contact spacing. Finally, in the automotive area, the LSS-110-03-F-DV-A is often used for airbag systems, navigation systems, and rearview camera systems.

The working principle behind the LSS-110-03-F-DV-A rectangular connector Array is simple. It features two vertical and two horizontal modules that are designed to provide contact between them. The modules consist of two rows of pins which are positioned in an offset arrangement. When the connector is applied onto the mating device, the electrical connections are made via the pins that are in contact with each other. This ensures a reliable and secure connection which is further reinforced by the two vertical terminals upon physical mating. The horizontal terminals are responsible for providing additional support to the connection by providing a mechanical locking function.

The advantages of the LSS-110-03-F-DV-A rectangular connector Array include its highly reliable and secure connection, its wide application field, its low cost, and its ease of use. Additionally, it is often seen as the best choice for applications requiring high contact density and high speed. It also has a versatile design that makes it easy to customize for different applications. Furthermore, its small size makes it applicable for small areas, such as on cell phone motherboards.

Overall, the LSS-110-03-F-DV-A is an excellent choice of a mezzanine (board-to-board) rectangular connector Arrays. It is highly reliable, versatile, and compact, making it the perfect choice for a variety of applications. Its wide application field and low cost make it a great choice for many different industries. Lastly, its easy-to-use design makes it the go-to choice for many designers.

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