LSS-130-02-F-DV-A-TR

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The LSS-130-02-F-DV-A-TR is a rectangular connector which operates in an array, edge type, mezzanine format in which the board must mount the contact interface from the mating side.
This connector supports the mating between 2 different boards, which will create a connection between the two through its connectors; while the edges of the boards will be filled and stabilized with a putty-like substance to secure the connection even further.
The connector has two rows of 13 contacts, and the contact surface is fully gold plated to guarantee an electrical, thermal, and mechanical connection in a wide variety of adverse environments. It also features a –40 to 105-degree Celsius temperature range.
The highest quality insulation material available in the market is used to insure a lifetime of reliable performance against chemistries, temperatures, and humilities, while its unique mechanical features, such as its high density pattern and narrow profile, makes the connector suitable for data, power and mixed signal requirements in a broad range of enclosure sizes.
The LSS-130-02-F-DV-A-TR has a current rating of 0.25 Amp per contact, over insulation of 5,000 MV humidity and 0.5 Amp per contact when installed in an array capable of fitting in a 1.50 mm² space. This allows the product to fulfil the needs of low and high data, mixed signals and power requirements.
When it comes to the dimensions of the connector, it has a width of 5.7 mm and a length of 18.4 mm, while its height varies from 1.5 mm to 3.43 mm, depending on the termination. Its operating geometry is a type D, type A variation; and its connector housing is made to comply with the design requirements of external shields that will use the soldermask, solder stand-off configurations.
The working principle of the LSS-130-02-F-DV-A-TR is simple: a low profile mezzanine board must be mounted on either side, the required connector pins are inserted into the respective board, and an adhesive or solder process is used to make a secure connection. The boards are then mated together and the final connection is established.

The specific data is subject to PDF, and the above content is for reference