LSS-130-03-F-DV-A

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Introduction: This paper is about LSS-130-03-F-DV-A application field and working principle, and it is classified under the category of Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board).

Application Field: Generally, the LSS-130-03-F-DV-A connector is widely used in advanced electronic computing and network communication equipment, and is applicable in various requirements for for densification and compactness. It is an excellent choice for applications that require high speed data transmission.Moreover, it can be used in mezzanine board-to-board systems and as an interconnect system between printed circuit board and daughter board systems.

Structure: The LSS-130-03-F-DV-A connector consists of two parts, a male part and a female part. The male part contains a housing, an insulator for holding terminals, and a set of contacts. The female part contains a housing, an insulator, and a series of contacts. The male and female parts are connected by a threaded or latch mechanism. The components are arranged in two columns, enabling high density interconnections with the smallest form factor. The LSS-130 series is available in different profiles, including low profile, mid-profile and high profile.

Electrical Characteristics: The LSS-130 series is designed to provide maximum reliability and performance. It has a contact resistance of less than 10 milliohms, a dielectric strength of 1500 volts, a current rating of 2 amps per contact, and an insulation resistance greater than 10 megaohms.

Working Principle: The LSS-130-03-F-DV-A connector operates on the principle of interconnecting electrical signals between the male and female parts via a pin and socket connection. The female part is connected to the board, and the cables are connected to the male part. When the connector is mated, electrical signals are transferred through the contacts and the electrical connection is established.

Features: The LSS-130-03-F-DV-A connector has several features that make it a popular choice for high-speed data transmission and mezzanine board-to-board systems. It is a high-density connector with two columns of contacts that makes it easy to route signals between different boards and achieve high densification. Additionally, the connector is designed with a low-profile design that enables increased flexibility in a compact form factor. It has a contact depth of less than 1mm, making it suitable for applications with limited space. The connector also has an extended switching life and a high signal-to-noise ratio.

Conclusion: In conclusion, the LSS-130-03-F-DV-A connector is a cost-effective, high-performance connector that offers an ideal solution for interconnect systems in mezzanine board-to-board systems and for a wide range of electronic computing and network communication applications. It is an excellent choice for high-speed data transmission and high density interconnections.

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