MAX6644LBAAEE+ Allicdata Electronics
Allicdata Part #:

MAX6644LBAAEE+-ND

Manufacturer Part#:

MAX6644LBAAEE+

Price: $ 1.62
Product Category:

Integrated Circuits (ICs)

Manufacturer: Maxim Integrated
Short Description: IC CNTRLR FAN SPEED 16-QSOP
More Detail: Fan Control, Temp Monitor -40°C ~ 125°C, External ...
DataSheet: MAX6644LBAAEE+ datasheetMAX6644LBAAEE+ Datasheet/PDF
Quantity: 370
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: $ 1.47420
10 +: $ 1.40049
25 +: $ 1.15290
50 +: $ 1.09532
250 +: $ 1.06533
500 +: $ 0.96300
Stock 370Can Ship Immediately
$ 1.62
Specifications
Topology: ADC, PWM Generator, Tach Counter
Base Part Number: MAX6644
Supplier Device Package: 16-QSOP
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3 V ~ 5.5 V
Output Fan: Yes
Output Alarm: Yes
Output Type: PWM
Series: --
Accuracy: ±3.5°C Local(Max), ±3°C Remote(Max)
Sensing Temperature: -40°C ~ 125°C, External Sensor
Sensor Type: Internal and External
Function: Fan Control, Temp Monitor
Moisture Sensitivity Level (MSL): --
Part Status: Active
Lead Free Status / RoHS Status: --
Packaging: Tube 
Description

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MAX6644LBAAEE+ Application Field and Working Principle

The MAX6644LBAAEE+ is a highly efficient thermal management solution that is suitable for applications requiring improved short-term reliability, increased accuracy and enhanced safety. The chip is specifically designed to meet the ever-growing needs of the thermal management community and is the latest in a number of systems developed by Maximizing.

Categorization

The MAX6644LBAAEE+ can be categorized as a PMIC - Thermal Management device. The main application fields of the chip include:

  • Thermal Protection
  • Temperature Control
  • Intelligence & Performance

Working Principle

The MAX6644LBAAEE+ utilizes the Dynamic Power Management System (DPMS) to operate the system automatically. This DPMS technology helps to maximize performance while reducing power consumption and increasing system efficiency. The chip also uses a highly accurate temperature sensing system to ensure that the system remains within the expected temperature ranges. This ensures that the system works reliably and accurately even in extreme conditions.

In addition, the chip also features a power regulator, allowing the system microcontroller to save energy when the system is not need to be actively running. This helps to increase system efficiency and reduce overall power consumption.

The chip also features a low temperature alarm that can be used to alert the system if the temperature drops below the predetermined range. This feature is useful for ensuring that the system remains within the accepted range during extreme environmental conditions.

The chip act as the central hub of the thermal management system, allowing the system to collect, analyze and manage temperature data from the various sensors deployed within the system. This helps to ensure that the thermal management system remains optimized and operates efficiently.

Benefits

The benefits of the MAX6644LBAAEE+ are numerous. The chip provides an efficient thermal protection solution that ensures improved short-term system reliability and longer life span. The chip also offers enhanced accuracy when collecting, analyzing and managing temperature data. The chip also saves power, resulting in a more efficient system performance. Finally, the chip also offers the advantage of a low temperature alarm, allowing the system to remain within the acceptable temperature range during extreme environments.

Conclusion

The MAX6644LBAAEE+ is a highly efficient thermal management solution suitable for applications requiring improved short-term reliability, increased accuracy and enhanced safety. The chip utilizes the Dynamic Power Management System and features a power regulator, temperature sensing system, and a low temperature alarm. The chip provides a number of benefits, including improved short-term system reliability and increased system efficiency. This makes it an ideal solution for thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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