MAX9300GGN/VY+TGGB

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The MAX9300GGN/VY+TGGB is a balanced multiprotocol serializer/deserializer (SERDES) offering excellent signal integrity for enterprise, data center, and long-reach terrestrial transmission. This SERDES can be used in multiple applications, such as 12.5Gbps serial Fibre Channel, 8.5Gbps CPRI (including 6.25Gbps CPRI option), 25/27Gbps Ethernet, or 25/54Gbps PCIe Gen 3. The MAX9300GGN/VY+TGGB also offers an excellent multiprotocol solution for driving multiple serial lanes in 10G, 25G/50G, and 100G/200G applications.

The MAX9300GGN/VY+TGGB comes in two configurations: the MAX9300VY+TGGB, which has a typical total jitter (TJ) of 12.6ps, and the MAX9300GGN+TGGB, which has a typical TJ of 10.5ps. Additionally, the device supports CPRI redundancy and FEC recovery. Both devices come in a 58-ball WFBG (Wafer Flat No Lead) package, which is a large-footprint package that is used where a high degree of thermal dissipation is required. The package also provides high resistance to shock and vibration during extreme temperature changes and shock events.

The MAX9300GGN/VY+TGGB supports up to four independent bank pairs, each with up to three forward motion channels and one backward motion channel. It can also support different types of data traffic and frame formats up to 25 Gb/s data rate. Additionally, the MAX9300GGN/VY+TGGB is compliant to the following standards: Serial Fibre Channel, 5G/10G/25G/50G/100G Ethernet, 6.25Gbps CPRI option, 8.5Gbps CPRI, 10GBASE-KR, and PCIe Gen 3.

The device\'s working principle lies in its ability to use digital and analog integration modules to provide a number of different functions. The digital module synthesizes and processes analog signals and also performs key digital functions, such as interface layer encoding, link layer encoding, wrapping, release functions, record/handshake functions, and more. The analog integration module includes the serializer, deserializer, preemphasis, equalization, crosstalk cancellation and low-pass filtering all in one integrated package. Its core capabilities are distributed across five highly integrated chipsets: the SerDes chip, the main chip, the IO chip, the reference clock chip and the disk chip.

The SerDes offers low-power operation and low-latency interfaces for data rates up to 12.5, 25, and 54 Gb/s. The main chip, the Xilinx Kintex-7 FPGA, handles the logic functions, while the reference clock chip ensures accuracy and helps reduce signal jitter. These three chips work together to provide excellent signal integrity and superior signal clarity, even in noisy environments. The IO chip is responsible for the signal input and signal output. The disk chip offers optimized features for embedded storage, such as HDD. The MAX9300GGN/VY+TGGB’s five chips are designed with the most advanced circuitry for signal conversion, signal regeneration, signal coding, and signal routing. The complete integration into a single device makes it easier to install, configure, and control.

The MAX9300GGN/VY+TGGB is a versatile, low-cost, SERDES-based solution for high-speed telecommunications, enterprise networks, and data centers. Its integrated circuitry and low-power operation make it well-suited for a variety of applications in these arenas. Its enhanced signal integrity and superior performance are key reasons why it is becoming a highly sought-after solution for next-generation networks. By consolidating multiple SERDES functions and multiple interface layers into a single device, the MAX9300GGN/VY+TGGB simplifies board design and reduces overall system cost. Furthermore, its advanced capabilities and easy scalability enable it to support multiple protocol requirements and enable enhanced user experience.

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