MDF7-12S-2.54DSA Allicdata Electronics
Allicdata Part #:

H2557-ND

Manufacturer Part#:

MDF7-12S-2.54DSA

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Hirose Electric Co Ltd
Short Description: CONN RECEPT 12POS SINGLE TIN
More Detail: 12 Position Receptacle, Bottom Entry Connector 0.1...
DataSheet: MDF7-12S-2.54DSA datasheetMDF7-12S-2.54DSA Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Insulation Color: Black
Contact Finish Thickness - Post: --
Contact Material: Phosphor Bronze
Contact Shape: Square
Insulation Material: Polyamide (PA), Nylon
Applications: --
Voltage Rating: 250VAC
Current Rating: 3A
Features: --
Ingress Protection: --
Mated Stacking Heights: --
Contact Finish - Post: --
Material Flammability Rating: UL94 V-0
Operating Temperature: -35°C ~ 85°C
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.197" (5.00mm)
Series: MDF7
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Fastening Type: Push-Pull
Termination: Solder
Mounting Type: Through Hole
Row Spacing - Mating: --
Number of Rows: 1
Pitch - Mating: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 12
Style: Board to Board
Contact Type: Female Socket
Connector Type: Receptacle, Bottom Entry
Part Status: Obsolete
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

MDF7-12S-2.54DSA is a type of rectangular connector from the Headers, Receptacles, Female Sockets category. MDF7-12S-2.54DSA is a multi-pin, high performance, signal and power connector system used in a variety of different applications, ranging from industrial and automotive requirements to medical and consumer markets. MDF7-12S-2.54DSA is a space saving and cost efficient wire to board and board to board connection solution.

MDF7-12S-2.54DSA has a durable, low profile design which allows for easy installation into development boards, embedded systems, external and internal enclosures, etc. The contact areas, consisting of a tin-plated copper alloy, withstand temperatures of up to 150°C and have high pressure resistance against water and dust. The MDF7-12S-2.54DSA connector also offers robust accidental mating protection with high retention force of up to 634N, depending on the contact size. This makes the MDF7-12S-2.54DSA an ideal choice for many applications, ranging from home appliances, electronic structures, electronic modules in automotive and robotics to medical equipment.

MDF7-12S-2.54DSA works based on a sliding contact system that connects two electrical circuits together by using a pair of headers and sockets. When two mating parts are brought together, the headers and sockets can slid together to create an electrical connection. As they slide together, the contact area is increased which helps ensure a stronger and more reliable connection.

The headers and sockets are made from a highly conductive material, such as copper, which ensures that electricity is able to transfer properly between the two parts. This material helps to improve the signal characteristics of the connector, providing better signal integrity and better overall performance. In addition, the headers and sockets feature a two-piece construction which helps to minimize contact resistance and keep the connection secure.

Furthermore, MDF7-12S-2.54DSA also offers numerous cost savings benefits, including a small footprint, faster assembly times, lower maintenance costs, and easier installation. The cost savings benefits of MDF7-12S-2.54DSA makes it an attractive option for a variety of applications, such as medical, industrial, and automotive requirements.

MDF7-12S-2.54DSA is a robust, reliable and cost effective solution for a variety of applications. It is designed to meet all industry standards and can be used in harsh environments. With its superior signal integrity and high retention force, MDF7-12S-2.54DSA is an ideal choice for all kinds of electronic structures, embedded systems, and consumer markets.

The specific data is subject to PDF, and the above content is for reference

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