MMA21-0111HU Allicdata Electronics
Allicdata Part #:

MMA21-0111HU-ND

Manufacturer Part#:

MMA21-0111HU

Price: $ 13.10
Product Category:

Connectors, Interconnects

Manufacturer: Vishay Dale
Short Description: CONN RACK/PANEL 11POS 5A
More Detail: N/A
DataSheet: MMA21-0111HU datasheetMMA21-0111HU Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
23 +: $ 11.90980
25 +: $ 11.41060
50 +: $ 10.69740
100 +: $ 10.34080
250 +: $ 9.77032
500 +: $ 9.48500
Stock 1000Can Ship Immediately
$ 13.1
Specifications
Series: MM22
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Plug, Male Pins
Connector Style: Rack and Panel
Number of Positions: 11
Number of Positions Loaded: All
Pitch: --
Number of Rows: 3
Number of Columns: --
Mounting Type: Panel Mount
Termination: Solder Cup
Contact Layout, Typical: --
Features: Screwlocks
Contact Finish: Gold
Contact Finish Thickness: 10.0µin (0.25µm)
Color: Green
Current Rating: 5A
Material Flammability Rating: --
Operating Temperature: --
Voltage Rating: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The MMA21-0111HU backplane connector is a specialized connector which is best suited to those applications in which a high-complex or demanding environment needs to be connected. This connector can be used to interconnect circuit boards in a variety of industries including computEr systems, telecommunications equipment, automation equipment and automation systems, as well as in other applications where the dynamic performance and/or the tight space requirements require extreme precision and reliability. The connector can be used in wide range of operating temperature environments and is suited to connector types ranging from small signal s to large power.

The MMA21-0111HU backplane connector is constructed from a high quality dielectric material with gold plating contacts. It features a low profile and has a small footprint and extreme durability. The connector has a rugged design and is specifically designed for applications in hostile environments where frequent plugging and unplugging are required. The connector is suitable for both plug-in and hardwired applications. It is compact and easy to install and can be used in a variety of applications.

The MMA21-0111HU backplane connector utilizes a double row connection configuration with multiple pin designs. The connector consists of two side-by-side rows of pins spaced evenly along the length of the connector. It features 1 x 50 discrete contacts as well as 1 x 5 dual row contacts and 1 x 25 dual row contacts. The connectors are polarized for correct mating and include lannets for easy alignment and snap finger retention for secure mating.

The working principle of the MMA21-0111HU backplane connector is simple but efficient. The double row configuration allows for a high number of contacts in a small space while ensuring direct and secure connection. The connector utilizes gold plating with low resistance contact finish to ensure high performance. The connector also features lannets for easy alignment and snap-in retention for quick and reliable installation. This connector is designed for high reliability and high vibration resistance in challenging environments where frequent plugging and unplugging is required.

The MMA21-0111HU backplane connector can be used in virtually any application wherehigh-density and demanding environment needs to be connected. The compact form factor and therugged design makes this an ideal choice for applications such as remote access and Embedded computing, as well as for those requiring extreme precision and reliability in high temperature and dynamic environments. The gold plated contacts offer superior performance and the lannets and snap-ins provide easy and secure installation. The double row configuration also offers considerable space reduction for high-density connections.

The specific data is subject to PDF, and the above content is for reference

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