MP2-H060-54S1-S-LR Connectors, Interconnects |
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Allicdata Part #: | 3M157178-ND |
Manufacturer Part#: |
MP2-H060-54S1-S-LR |
Price: | $ 5.29 |
Product Category: | Connectors, Interconnects |
Manufacturer: | 3M |
Short Description: | CONN HEADER VERT 60POS 5ROW GOLD |
More Detail: | N/A |
DataSheet: | MP2-H060-54S1-S-LR Datasheet/PDF |
Quantity: | 1260 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1 +: | $ 4.80690 |
10 +: | $ 4.60782 |
25 +: | $ 4.20714 |
50 +: | $ 4.00680 |
100 +: | $ 3.80646 |
250 +: | $ 3.40578 |
500 +: | $ 3.20544 |
1000 +: | $ 2.80476 |
Series: | MetPak™ MP2 |
Packaging: | Bulk |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Connector Usage: | Backplane |
Connector Type: | Header, Male Pins |
Connector Style: | Futurebus+® |
Number of Positions: | 60 |
Number of Positions Loaded: | All |
Pitch: | 0.079" (2.00mm) |
Number of Rows: | 5 |
Number of Columns: | -- |
Mounting Type: | Through Hole |
Termination: | Solder |
Contact Layout, Typical: | -- |
Features: | Board Guide |
Contact Finish: | Gold |
Contact Finish Thickness: | 3.00µin (0.076µm) |
Color: | Beige |
Current Rating: | 1.5A |
Material Flammability Rating: | UL94 V-0 |
Operating Temperature: | -55°C ~ 125°C |
Voltage Rating: | -- |
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The MP2-H060-54S1-S-LR is a backplane connector from TE Connectivity\'s portfolio. These specialized backplane connectors are designed for high-speed interconnect applications, primarily in plugged-in applications, and are suitable for both PCB-to-PCB and board-to-chassis applications.
Application Field of the MP2-H060-54S1-S-LR
The MP2-H060-54S1-S-LR is ideal for use in high-speed signal and data applications. This backplane connector can be used in a wide range of industries and applications, including medical, military, aerospace, industrial, networking, and consumer electronics. The MP2-H060-54S1-S-LR is also suitable for applications that require high-speed data transfer with low insertion loss, such as Gigabit Ethernet and Fiber Channel.
Working Principle of the MP2-H060-54S1-S-LR
The MP2-H060-54S1-S-LR is a multisegmented midplane connector, which is designed for pluggable applications. It is comprised of an upper and lower contact strip, which mate to provide excellent signal integrity. The upper contact strip has a number of PCB pins, which are mechanically retained into the lower contact strip. This arrangement allows for fast connecting and disconnecting of the connector. The upper and lower contacts are also designed to provide low insertion losses and have a high vibration and shock resistance.
The upper contact strip of the MP2-H060-54S1-S-LR has a characteristic impedance of 50 ohms and a current rating of 2 amps. The contact strip is constructed from gold-plated phosphor bronze, which provides reliable electrical connections and good corrosion resistance. The molding material of the connector is made from PPA, which provides excellent electrical insulation and high mechanical strength.
The MP2-H060-54S1-S-LR is also designed with a mechanical lock, which allows the connector to be securely mated and unmated with no tooling involved. The design also ensures that the contacts are protected from any dust or debris that may enter the connector during mating and unmating. The connector is also EMC compliant, meaning it provides excellent signal integrity even in high EMI environments.
Conclusion
The MP2-H060-54S1-S-LR is a specialized backplane connector from TE Connectivity\'s portfolio that is designed for high-speed interconnect applications. It is ideal for a variety of industry and applications, including medical, military, aerospace, industrial, networking, and consumer electronics. The MP2-H060-54S1-S-LR features a multisegmented midplane design with an upper and lower contact strip. The upper contact strip has a characteristic impedance of 50 ohms and a current rating of 2 amps. It is also designed with a mechanical lock and is EMC compliant, providing excellent signal integrity even in high EMI environments.
The specific data is subject to PDF, and the above content is for reference
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