Allicdata Part #: | MP2-H240-51S1-S-TG30-ND |
Manufacturer Part#: |
MP2-H240-51S1-S-TG30 |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | 3M |
Short Description: | CONN HEADER VRT 240POS 5ROW GOLD |
More Detail: | N/A |
DataSheet: | MP2-H240-51S1-S-TG30 Datasheet/PDF |
Quantity: | 1000 |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
1 +: | 0.00000 |
Number of Columns: | -- |
Voltage Rating: | -- |
Operating Temperature: | -55°C ~ 125°C |
Material Flammability Rating: | UL94 V-0 |
Current Rating: | 1.5A |
Color: | Beige |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Contact Finish: | Gold |
Features: | Board Guide |
Contact Layout, Typical: | -- |
Termination: | Solder |
Mounting Type: | Through Hole |
Series: | MetPak™ MP2 |
Number of Rows: | 5 |
Pitch: | 0.079" (2.00mm) |
Number of Positions Loaded: | All |
Number of Positions: | 240 |
Connector Style: | Futurebus+® |
Connector Type: | Header, Male Pins |
Connector Usage: | Backplane |
Moisture Sensitivity Level (MSL): | -- |
Part Status: | Obsolete |
Lead Free Status / RoHS Status: | -- |
Packaging: | Bulk |
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Backplane connectors such as the MP2-H240-51S1-S-TG30 have significantly different applications than standard connectors. They are used in high-speed servers, switches, and communication systems, where they connect motherboards and backplanes together. Therefore, the MP2-H240-51S1-S-TG30 must be able to handle higher numbers of connections with lower propagation delays, higher bandwidths, and more rigorous signal integrity demands than standard connectors.
The MP2-H240-51S1-S-TG30 has 240 signal signal contacts in the X direction, while the contacts in the Y direction provide 51 power levels. The MP2-H240-51S1-S-TG30 utilizes a spring-rocker system for signal contacts and a 0.6mm preload for power contacts, enabling them to connect with secure hold-down force. The power contacts require 0.18mm of current-carrying capacity, allowing them to transfer significantly higher power than standard connectors. The gross mating height of the MP2-H240-51S1-S-TG30 is 0.34mm, making it compatible with a wide range of backplanes.
Besides contact configurations and mating heights, the MP2-H240-51S1-S-TG30 also prevent crosstalk and improve signal integrity. This is accomplished through its unique design; its signal contacts are placed in the inner area of the connector, while its power contacts are arranged at the outer area. This positioning of the contacts provides better shielding to the connector, which results in higher signal integrity and lower crosstalk. Moreover, the signal contacts feature a three-point spring contact system to ensure reliable contact-to-contact mating. This system helps reduce the insertion force of the contacts and minimizes the contact resistance. Furthermore, the connector also features a vibration shielding system that increases resistance to environmental vibration and ensures high signal integrity performance.
In conclusion, the MP2-H240-51S1-S-TG30 is an ideal connector solution for high-speed servers, switches, and communication systems. By featuring a wide array of contact configurations and mating heights, this backplane connector provides increased bandwidth and lower propagation delays while ensuring impeccable signal integrity with low levels of crosstalk. It enables reliable and efficient connections between motherboards and backplanes, making it a must-have for today’s high-speed systems.
The specific data is subject to PDF, and the above content is for reference
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