
Allicdata Part #: | MP2-H300-51S2-S-TR30-ND |
Manufacturer Part#: |
MP2-H300-51S2-S-TR30 |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | 3M |
Short Description: | CONN HEADER VRT 300POS 5ROW GOLD |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
1 +: | 0.00000 |
Number of Columns: | -- |
Voltage Rating: | -- |
Operating Temperature: | -55°C ~ 125°C |
Material Flammability Rating: | UL94 V-0 |
Current Rating: | 1.5A |
Color: | Beige |
Contact Finish Thickness: | 3.00µin (0.076µm) |
Contact Finish: | Gold |
Features: | Board Guide |
Contact Layout, Typical: | -- |
Termination: | Solder |
Mounting Type: | Through Hole |
Series: | MetPak™ MP2 |
Number of Rows: | 5 |
Pitch: | 0.079" (2.00mm) |
Number of Positions Loaded: | All |
Number of Positions: | 300 |
Connector Style: | Futurebus+® |
Connector Type: | Header, Male Pins |
Connector Usage: | Backplane |
Moisture Sensitivity Level (MSL): | -- |
Part Status: | Obsolete |
Lead Free Status / RoHS Status: | -- |
Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The MP2-H300-51S2-S-TR30 is a specialized backplane connector technology used for connection between circuit boards or midplanes. It is a double-row, soldered wire connector with high temperature resistance features and is used heavily in industrial and aerospace applications.
The connector is a small, low profile connector with a 50.5 mm profile depth. It is constructed with a molded glass reinforced polyphenylene sulfide terminated by gold-plated contact pins. It has a total of 22 signal contacts, 51 power contacts, and 2 signal/power (s/p) contacts. Its unique design allows the MP2-H300-51S2-S-TR30 to be used in a wide range of applications from low-profile designs like laptops and portable electronics to high-performance applications like server, storage, medical and automotive industries.
The MP2-H300-51S2-S-TR30 can be used in applications that require high speed data transfer, video/audio signal processing, storage, and other sophisticated applications. It is an ideal solution for applications which need to transfer high speed digital signals with low power consumption and without triggering the IC. In addition, its design provides the versatility of connecting multiple signal lines with different voltages and powering them with a common power source.
The working principle behind the MP2-H300-51S2-S-TR30 is based on a pin and socket design, which allows it to be used as a power connector as well as a signal connector. The jack pins are inserted into the socket, which then act as a current plug to connect the power line to the circuitry. When the signal is present, the corresponding socket in the connector will pass the signal from the IC to the pin, and vice versa. This way, the MP2-H300-51S2-S-TR30 can be used to provide power to the IC, as well as signal and power drive applications.
In terms of its construction, the MP2-H300-51S2-S-TR30 is a hermetically sealed connector that is designed to provide reliable performance in extreme temperature environments. Its robust design also minimizes the risk of EMI (electromagnetic interference) generated due to accidental contact between pins and other components during installation. This makes the connector well suited for use in harsh industrial and high-reliability environments.
The MP2-H300-51S2-S-TR30 is an ideal solution for applications requiring high-inventory, minimal cost, and reliable performance. It is particularly well suited for applications in the medical, military, and aerospace industries. Its robust construction provides a high level of performance in extreme temperatures and also reduces the risk of unintentional grounding or other hazards due to its hermetically sealed enclosure. Additionally, the MP2-H300-51S2-S-TR30 can easily be customized for specific applications.
The specific data is subject to PDF, and the above content is for reference
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