MP2-HP08-41P1-KR

Series:	MetPak™ MP2
Packaging:	Tube
Lead Free Status / RoHS Status:	--
Part Status:	Active
Moisture Sensitivity Level (MSL):	--
Connector Usage:	Backplane
Connector Type:	Header, Male Blades
Connector Style:	Blade Power
Number of Positions:	8
Number of Positions Loaded:	All
Pitch:	0.236" (6.00mm)
Number of Rows:	4
Number of Columns:	--
Mounting Type:	Through Hole
Termination:	Press-Fit
Contact Layout, Typical:	8 Power
Features:	--
Contact Finish:	Gold
Contact Finish Thickness:	30.0µin (0.76µm)
Color:	Beige
Current Rating:	--
Material Flammability Rating:	UL94 V-0
Operating Temperature:	-55°C ~ 125°C
Voltage Rating:	--

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（2,000words）MP2-HP08-41P1-KR Backplane Connectors - SpecializedBackplane connectors, also known as system connectors, play an important role in today’s electronic systems. In addition to playing a fundamental role in connecting a PCB to the circuit board, they’re also utilized to establish communication between centralized logic or memory modules and peripheral I/O functions. As such, backplane connectors must be capable of withstanding the rigorous demands of high-speed data transfer and dense packaging of today’s electronics. The MP2-HP08-41P1-KR backplane connector is a high-performance version of a system connector that is designed to meet the demands of high-speed data transfer. This specialized product from the leading connector manufacturer Samtec features a wide variety of mechanical and electrical characteristics that make it an attractive option for a range of application fields. This high-density, high-speed backplane connector boasts a rugged design with high-speed data transfer and low-power consumption. It supports a wide range of signals from DC to 32 GHz, making it well suited for applications that involve large bandwidth and fast data transfer rates. It is also well-suited for high-density, stackable applications, making it the ideal choice for applications such as datacom, telecom, and computing. The MP2-HP08-41P1-KR features a patented contact design that enables high-speed data transfer. It is compliant with specifications for blind-mating, which allows for easy installation and maintenance. Its robust design offers superior reliability and excellent signal integrity for reliable data transmission. The connector also incorporates cutting-edge technology such as integral strain relief to prevent cable fatigue and ensure a secure mechanical connection. The MP2-HP08-41P1-KR is a modern backplane connector that addresses the needs of multiple applications. With its wide range of features and capabilities, it is the ideal choice for applications that require high-speed data transfer, high-density, stackable configurations and excellent signal integrity. The working principle of the MP2-HP08-41P1-KR backplane connector is simple. The connector works by connecting two or more boards together. The connector is placed between two or more PCB’s and each board is connected to pins on the connector. The pins are then connected to a mating board, allowing for the transfer of signals, data, power, and other information between the boards. The contact design of the MP2-HP08-41P1-KR backplane connector is optimized to ensure swift and accurate data transmission. The contact mating force is optimized for low-to-medium impedance applications, and there is low-resistance signal routing between the contact interface and the cable interface. This helps to ensure that signals are transferred exactly as intended with no loss of signal integrity. The connector also boasts a number of novel features that help to improve signal integrity. For instance, the connector features built-in strain relief technology, which helps to protect the cable from any damage or bending that may occur during installation. Additionally, the connector also features an integrated, secure mechanical connection which helps to ensure that the connector is held securely once connected. In summary, the MP2-HP08-41P1-KR backplane connector is an excellent solution for applications that require high-speed data transfer and high-density, stackable configurations. Its robust design combines a number of clever features to ensure swift and accurate data transmission with no loss of signal integrity, making it the ideal choice for a range of applications.

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