MP2-S210G-51M1-C-TG30

MP2-S210G-51M1-C-TG30 backplane connectors are a specialized type of connector used in a variety of electronic devices. These specialized connectors offer a reliable, low-cost, and high-performance solution for backplane-to-board interconnects. They can be found in many telecom, industrial, and computing applications.

The MP2-S210G-51M1-C-TG30 connector is composed of three main parts – a housing, a contact, and a pinout. The housing is typically made of a plastic material such as polycarbonate that provides a tight internal fit and is capable of withstanding temperatures from -40°C to 105°C. The contact, which can be pre-wired or soldered, is usually made of tin-plated copper material and offers a higher current and voltage rating than standard connectors. Finally, the pinout allows for easy mounting as the pins are securely housed in the connector.

The MP2-S210G-51M1-C-TG30 connector can be used in various applications such as backplane interconnects and high-speed signal routing. For backplane interconnects, the connector provides reliable and cost-effective connectivity between different components, boards, and systems. The connector is also well-suited for high-speed signal routing as it offers an outstanding signal integrity compared to other types of connectors.

The working principle of the MP2-S210G-51M1-C-TG30 backplane connector is based on two core technologies – impedance matching and signal shielding. The impedance matching plays a critical role in optimizing the signal transmission as it reduces reflections and provides a higher signal quality. The shielding of the connector also improves the overall signal integrity by blocking EMI.

MP2-S210G-51M1-C-TG30 backplane connectors are a reliable solution for a range of applications. Their reliable and robust design makes them suitable for a range of data and power transfer applications, both in telecom and industrial markets. Additionally, the connector’s ability to provide clean and reliable signal integrity, as well as its impedance matching and signal shielding technologies, make it an outstanding choice for high-speed signal routing.