MP2-SS090-51S2-TG30 Allicdata Electronics
Allicdata Part #:

MP2-SS090-51S2-TG30-ND

Manufacturer Part#:

MP2-SS090-51S2-TG30

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: 3M
Short Description: CONN SOCKET 2-FB 90POS 5ROW
More Detail: N/A
DataSheet: MP2-SS090-51S2-TG30 datasheetMP2-SS090-51S2-TG30 Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: --
Voltage Rating: --
Operating Temperature: -55°C ~ 125°C
Material Flammability Rating: UL94 V-0
Current Rating: 1.5A
Color: Beige
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: Board Guide, Spacer
Contact Layout, Typical: --
Termination: Solder
Mounting Type: Board Edge, Through Hole, Right Angle
Series: MetPak™ MP2
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions Loaded: All
Number of Positions: 90
Connector Style: Futurebus+®
Connector Type: Receptacle, Female Sockets
Connector Usage: Backplane
Moisture Sensitivity Level (MSL): --
Part Status: Obsolete
Lead Free Status / RoHS Status: --
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors are used in a variety of applications, ranging from for industrial control systems to communication networks, military systems, and aerospace platforms. The MP2-SS090-51S2-TG30 backplane connector offers dependable performance, reliable operation, and cost-efficiency for a variety of backplane applications.

This high-density board-to-board connector features a double row, 84-pin configuration, and is ideally suited for a variety of backplane applications including, but not limited to, data acquisition systems, instrumentation systems, system motherboards, industrial computers, and embedded control systems. It features a robust gold-plated terminal design for superior signal transmission and mating assurance. It also features a unique durable design that allows it to withstand a wide variety of environmental conditions, including extreme temperatures, environmental contaminants, and vibration.

The MP2-SS090-51S2-TG30 is an ideal solution for a wide variety of backplane applications due to its low-profile design and high-density board-to-board interface. It provides a reliable signal connection between separate boards while at the same time maintaining a low profile and offering a cost-effective solution.

This specialized backplane connector allows for the efficient transfer of signals and data between two adjacent boards. It features a reliable gold-plated contact system with a low insertion force, providing an easy connection even in environments where tight connections are desired. Additionally, the specialty interlocking feature ensures that the connector remains firmly secured to reduce the risk of misconnections or signal loss.

The backplane connector is designed using a high-speed though hole (TH) process, allowing for efficient, yet reliable signal transmission. It is ideal for tight connection applications and is designed to withstand a wide variety of environmental conditions, ensuring reliable operation even in extreme temperatures, humidity levels, and vibration. Additionally, the MP2-SS090-51S2-TG30 features a unique seal-in design that eliminates the need for additional data plane or retention plates, ensuring a robust connection for reliable signal transmission.

The MP2-SS090-51S2-TG30 is ideally suited for a variety of high-density backplane applications. It provides a dependable connection even in the most demanding environments, and its robust gold-plated terminals ensure superior signal transmission and mating assurance. This specialized backplane connector is a cost-effective and feature-rich solution for a variety of applications where reliable data transmission and signal integrity are of paramount importance.

The specific data is subject to PDF, and the above content is for reference

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