MP26T1-C19-4070-RS-1-00 Allicdata Electronics
Allicdata Part #:

MP26T1-C19-4070-RS-1-00-ND

Manufacturer Part#:

MP26T1-C19-4070-RS-1-00

Price: $ 51.25
Product Category:

Optoelectronics

Manufacturer: Opulent Americas
Short Description: MOD BLOCK XHP35 4000K RECTANGLE
More Detail: LED Lighting COBs, Engines, Modules *
DataSheet: MP26T1-C19-4070-RS-1-00 datasheetMP26T1-C19-4070-RS-1-00 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
500 +: $ 46.59640
Stock 1000Can Ship Immediately
$ 51.25
Specifications
Series: *
Part Status: Active
Lead Free Status / RoHS Status: --
Moisture Sensitivity Level (MSL): --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

MP26T1-C19-4070-RS-1-00 in LED Lighting - COBs, Engines, Modules

MP26T1-C19-4070-RS-1-00, part of Cree’s lineup of LED Lighting materials, is a package of Copper Bonded Ceramic Substrate, a ceramic substrate with copper bonds, which is an ideal heat sink for high power LED lighting applications. This package is designed for mounting LED engines with 22mm or 25mm LED Cob packages. It has a rated power of up to 30W and supports a wide range of LED lighting applications such as street lighting, retail lighting, office lighting, and more. It provides excellent thermal conductivity, which leads to improved LED performance, increases in LED life and lower total cost per watt.

Application Field

MP26T1-C19-4070-RS-1-00 is designed for mid-power LED lighting applications such as indoor or outdoor commercial, municipal, and industrial applications. High-powered applications such as stadium lighting, high bay lighting and billboard lighting can benefit from the power and energy efficiency of the product. Due to its excellent thermal conductivity and wide range of power output, MP26T1-C19-4070-RS-1-00 is an ideal solution for a wide range of lighting applications.

Working Principle

MP26T1-C19-4070-RS-1-00 works by providing an efficient heat dissipation and cooling system for LED lighting. The package consists of a Copper-Bonded Ceramic Substrate, which utilizes the combination of copper and ceramic materials to provide a highly thermally conductive path. The design of the package helps to quickly remove the heat created by the LED packaging, thus increasing the lifespan of the LED and increasing the efficiency of the lighting system. The package also helps to reduce overall system costs, by allowing the same size or smaller LED lighting packages to be used for higher wattage applications.

Advanced Features

MP26T1-C19-4070-RS-1-00 also has additional features that make it a great product. It has excellent thermal resistance and mechanical shock and vibration resistance. The package also has high current capacity, which allows for quicker startups and longer LED life. The package also features low thermal dissipation, which is imperative for high-powered applications.

Conclusion

For LED lighting applications, MP26T1-C19-4070-RS-1-00 is a great package that provides the thermal conductivity and shock resistance that are needed for the applications. The package is ideal for mid-power and high-power applications, such as commercial, industrial, and outdoor lighting. The package also has features such as high current capacity, low thermal dissipation, and mechanical shock and vibration resistance. All of these features make it a great option for LED lighting applications.

The specific data is subject to PDF, and the above content is for reference

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