| Allicdata Part #: | MTFC32GLXDM-WT-ND |
| Manufacturer Part#: |
MTFC32GLXDM-WT |
| Price: | $ 0.00 |
| Product Category: | Integrated Circuits (ICs) |
| Manufacturer: | Micron Technology Inc. |
| Short Description: | IC FLASH 256G MMC 153TFBGA |
| More Detail: | FLASH - NAND Memory IC 256Gb (32G x 8) MMC |
| DataSheet: | MTFC32GLXDM-WT Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
| Series: | e•MMC™ |
| Packaging: | Tube |
| Part Status: | Obsolete |
| Memory Type: | Non-Volatile |
| Memory Format: | FLASH |
| Technology: | FLASH - NAND |
| Memory Size: | 256Gb (32G x 8) |
| Write Cycle Time - Word, Page: | -- |
| Memory Interface: | MMC |
| Voltage - Supply: | 2.7 V ~ 3.6 V |
| Operating Temperature: | -25°C ~ 85°C (TA) |
| Mounting Type: | Surface Mount |
| Package / Case: | -- |
| Supplier Device Package: | -- |
| Base Part Number: | MTFC32G |
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MTFC32GLXDM-WT: A Memory with a Variety of Application Fields and Working Principles
The MTFC32GLXDM-WT is a type of memory that has a variety of application fields and working principles. It is a monolithic type of Non-Volatile Memory (NVM) that is designed for compatibility in applications such as personal computers, set top boxes, mobile communication devices, industrial control, medical and automotive solutions.
The MTFC32GLXDM-WT is an integrated device that uses a single chip package that has an advanced die-to-die bonding technology. This type of memory doesn’t need support circuitry or packaging layers making it ideal for applications with space, cost, and performance constraints.
This memory device uses the MoviNAND protocol which is optimized for speed and performance. Its advanced die-to-die bonding technology ensures a high data transmission rate while providing reliability and stability and consumes low levels of power.
The MTFC32GLXDM-WT features an internal 64M-byte NOR Flash memory. The memory is organized as 32 blocks, each block with 32K-bytes. The device has four-bits of ECC (error correction code for data protection) in the internal Flash memory. It also contains hardware support for error-correcting code, redundancy and random number generation.
The internal 32M-byte NAND Flash memory is organized as 16 blocks each with 512K-bytes. The device has four-bits of BCH (Block Check or Error Correction) for data protection. Besides hardware support for error-correcting code, redundancy, and random number generation, it has four independent terms of redundancy bits.
The MTFC32GLXDM-WT memory device also features an advanced Flash buffer control and an enhanced I/F (Industrial Firmware) that is optimized to execute power-down sequences and over drive write sequences. The advanced Flash buffer control increases the speed of data read, write and erase operations and reduces latency to allow better system performance.
The MTFC32GLXDM-WT memory device has a wide range of applications due to its variety of sequences suitable for different memory operations. Its low power consumption makes it suitable for battery powered devices such as smartphones and tablets. It is also used in applications that require high speed, such as gaming and multimedia.
In conclusion, the MTFC32GLXDM-WT memory device has a variety of applications due to its range of working principles and advanced features. Its advanced Flash buffer control and error correction capabilities make it ideal for applications with space, cost and performance constraints.
The specific data is subject to PDF, and the above content is for reference
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MTFC32GLXDM-WT Datasheet/PDF