PA-TS1D6SM18-40 Allicdata Electronics
Allicdata Part #:

309-1102-ND

Manufacturer Part#:

PA-TS1D6SM18-40

Price: $ 13.86
Product Category:

Connectors, Interconnects

Manufacturer: Logical Systems Inc.
Short Description: ADAPTER 40TSOP TO 40DIP
More Detail: IC Socket Adapter TSOP To DIP Through Hole
DataSheet: PA-TS1D6SM18-40 datasheetPA-TS1D6SM18-40 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: $ 12.60000
Stock 1000Can Ship Immediately
$ 13.86
Specifications
Series: --
Part Status: Active
Lead Free Status / RoHS Status: --
Convert From (Adapter End): TSOP
Moisture Sensitivity Level (MSL): --
Convert To (Adapter End): DIP
Number of Pins: 40
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: --
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: --
Housing Material: --
Board Material: --
Termination Post Length: 0.125" (3.18mm)
Material Flammability Rating: --
Features: --
Operating Temperature: --
Contact Material - Mating: --
Contact Material - Post: --
Contact Finish Thickness - Mating: --
Contact Finish Thickness - Post: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The PA-TS1D6SM18-40 is an adapter socket for ICs and transistors, and it offers industry-leading performance and quality. This adapter socket is designed to facilitate quick and easy connection of an IC or transistor to a board, allowing engineers to work with stability and minimal risk of damage. This socket can be used for prototyping of electronics circuits, testing and reverse engineering of electronic components, as well as general research purposes.

The PA-TS1D6SM18-40 adapter socket is a multi-stage construction consisting of a main body, an upper and lower base, and an end cap. The main body serves as the connection point between the IC or transistor and the user’s circuitry. The upper and lower base provide electrical and mechanical contact between the IC or transistor and the main body. And the end cap is used for connection and disconnection of the IC or transistor when the socket is in use.

In terms of performance, the PA-TS1D6SM18-40 adapter socket provides excellent signal quality for reliable and error-free functioning, with low contact resistance and high thermal stability. It also features a robust design that can withstand shocks and vibration while in operation. Additionally, it comes with proprietary technology that uses metal pins to ensure reliable and secure hold of the IC or transistor, while still allowing for easy disconnection for safety purposes.

In terms of application fields, the PA-TS1D6SM18-40 adapter socket is designed for a wide range of uses, including prototyping of electronics circuits, testing and reverse engineering of electronic components, and general research purposes. It can also be used as an adapter socket for a variety of other applications, such as remoting, testing, or remote monitoring of components.

In terms of working principle, the PA-TS1D6SM18-40 adapter socket utilizes a simple yet effective design to provide reliable connections between an IC or transistor and a board or circuit. It is designed to facilitate a secure and hassle-free connection that ensures uninterrupted signal quality by eliminating potential points of failure. The upper and lower base provide electrical and mechanical contact between the IC or transistor and the main body, while the end cap serves as the connection and disconnection point when the socket is in use.

The PA-TS1D6SM18-40 adapter socket is a reliable and high-performance socket that is designed to meet the most demanding engineering requirements and provide reliable and safe connections between an IC or transistor and a board or circuit. This socket is capable of providing excellent signal quality, making it perfect for prototyping of electronic circuits, testing and reverse engineering of electronic components, and general research purposes.

The specific data is subject to PDF, and the above content is for reference

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