QFS-016-04.25-H-D-DP-PC8

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The QFS-01604.25-H-D-DP-PC8 is one of the rectangular connectors in Arrays, Edge Type, Mezzanine (Board to Board) category. It is a type of mezzanine connector widely used in different boards and electronic components and assemblies.

The QFS-01604.25-H-D-DP-PC8 is primarily used to interconnect two boards, NTEs, and PCAs for a wide range of applications including chassis A/B, consumer printers, cameras and medical devices. The connector is compliant with RoHS 2 with no halogenated flame retardants or plasticizers, and it is designed to provide reliable and secure board-to-board connectivity even in the harshest electromagnetic interference environments. It is also designed to accept a range of pin sizes and to provide a high-voltage, high-current interface.

The connector is composed of two boards mounted on opposite sides of an array of pins. The two parts have an integrated locking mechanism to ensure a strong electrical connection. The pins fit securely into the foam-filled sockets of both boards and the locking mechanism is typically activated by an integral spring which keeps the boards firmly pressed together. Each connector also has a heat-resistant polycarbonate cover which protects the pins and helps avoid short-circuiting. The copper-plated pins provide good electrical contact and maximize current-carrying capacity.

The QFS-01604.25-H-D-DP-PC8 is designed with a 1.27mm pitch, allowing the connector to be used in applications that require small form factor and high packing density. Additionally, its plug-and-play capabilities allow easy installation of different boards and components. The connector is designed to meet the needs for high-speed signal transmission and data transmission, as well as power applications.

The QFS-01604.25-H-D-DP-PC8 is a reliable and secure solution for board-to-board applications in areas such as computers, medical and industrial automation. Its design ensures a high-frequency signal and data transmission, as well as a reliable and secure connection. Its 1.27mm pitch and robust construction make it ideal for applications requiring small form factor and high density terminations. Furthermore, its plug-and-play capabilities make it a time-saving and cost-effective solution.

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