QFS-016-04.25-L-D-DP-A-GP

Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)

QFS-016-04.25-L-D-DP-A-GP application field and working principle

QFS-016-04.25-L-D-DP-A-GP is a high-speed signal chip-to-chip connection solution used to complement FPGA high-speed signal interface. It adopts the edge connector array including edge type connector mezzanine technology to achieve high-speed signal interconnection between boards-and-boards. This connection solution provides high-speed signal interconnection capability with high bandwidth, high insulation resistance and excellent anti-vibration/anti-interference performance.

Application fields of QFS-016-04.25-L-D-DP-A-GP

QFS-016-04.25-L-D-DP-A-GP is typically used in FPGA backplane applications, highly integrated electronics, server systems, modem systems, and communications transistor-to-board signal crossovers for high-speed multilink signal interconnections that fit extremely tight space requirements. It is suitable for applications in Ethernet switches, routers, digital audio/video products, medical and broadcasting equipment, as well as optical communication and networking.

Working principle of QFS-016-04.25-L-D-DP-A-GP

QFS-016-04.25-L-D-DP-A-GP works on the premise of using the pin headers of the FPGA boards. The contact pin of the FPGA board is directly connected to the edge connector by the copper stamping support of the mezzanine module. Then, the mezzanine module is connected to the solder pad of the high-speed signal connection port on the FPGA board. The working principle of this connection solution is like an "L-shaped connection with total double sides", which is one of the key aspects to secure transmission quality of the signal.

The main advantages of QFS-016-04.25-L-D-DP-A-GP include high transmission bandwidth, stable signal transmission, and high level of x-ray and environmental radiation tolerance. This edge type connector mezzanine is also vibration and shock resistant, thus ensuring safe and reliable transmission. Moreover, the shielded design helps to maintain excellent signal integrity, providing an ideal interconnection of up to 32 lanes of 10 Gbps signals. QFS-016-04.25-L-D-DP-A-GP also supports hot plugging and has specifications compatible with high-quality FPGA boards and widely available pin headers.