QFS-032-04.25-L-D-DP-A-P-TR Allicdata Electronics
Allicdata Part #:

QFS-032-04.25-L-D-DP-A-P-TR-ND

Manufacturer Part#:

QFS-032-04.25-L-D-DP-A-P-TR

Price: $ 5.19
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: QFS .635MM STRIPS
More Detail: 64 Position Connector Differential Pair Array, Fem...
DataSheet: QFS-032-04.25-L-D-DP-A-P-TR datasheetQFS-032-04.25-L-D-DP-A-P-TR Datasheet/PDF
Quantity: 1000
125 +: $ 4.70988
Stock 1000Can Ship Immediately
$ 5.19
Specifications
Series: Power Q2™ QFS
Packaging: Tape & Reel (TR) 
Part Status: Active
Connector Type: Differential Pair Array, Female
Number of Positions: 64
Pitch: 0.025" (0.64mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Board Guide, Ground Bus (Plane), Pick and Place
Contact Finish: Gold
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 10mm, 11mm, 14mm
Height Above Board: 0.278" (7.06mm)
Description

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QFS-032-04.25-L-D-DP-A-P-TR is a special type of rectangular connector array edge type, mezzanine (board-to-board) connector. Structurally, it is composed of two separate boards, each in a rectangular shape and held together in an operating unit. One board serves as the mounting contact point, the other serves as the mating contact point. This kind of connector is used in high-speed circuit applications and is used to connect two or more circuits together in a very compact form.

The application field of QFS-032-04.25-L-D-DP-A-P-TR mainly includes surface-mount, through-hole and multi-row components. It is usually used in the aircraft and aerospace industry, industrial controller and power control equipment, telecommunications, industrial automation, medical equipment, military electronics, civil electronics, and other fields. It also has general purpose applications.

QFS-032-04.25-L-D-DP-A-P-TR has an effective working principle. It is a combination of two boards that are mounted together in a secure manner. One of the boards serves as the contact point while the other serves as the mating contact for the circuit connections. The connection between the two boards is usually done by soldering or by using a connector that has a specific shape and size depending on the application. The power and signal are normally transmitted via the conductive pathways of the board, and the contacts are formed using a variety of materials that have different properties.

The contact points of QFS-032-04.25-L-D-DP-A-P-TR have a very low resistance which enables them to carry extremely high signal current and voltage without sacrificing signal integrity. The board also has high levels of isolation, which is important for reducing any type of crosstalk between the various circuits. The contacts are also designed to be resistant to corrosion and other environmental factors, making them suitable for use in a wide range of applications.

The two boards used in the QFS-032-04.25-L-D-DP-A-P-TR are held together by a platform that is designed to provide extra strength and to reduce mechanical vibration or shock. The two boards are typically held together using a variety of metallurgical treatments, including cold welding, soldering, or epoxy resin, and the two boards can be held together in a secure manner by the use of a connector that has a locking mechanism.

Other features of the QFS-032-04.25-L-D-DP-A-P-TR include a low profile, which make it ideal for applications where space is at a premium, and a high temperature range, making it ideal for applications that may require it to work in extreme temperatures. The connector also has a high density interconnection, making it suitable for applications where signals need to be joined up quickly and reliably.

All in all, the QFS-032-04.25-L-D-DP-A-P-TR is a special type of rectangular connector array, edge type, mezzanine (board-to-board) connector that is used in high-speed circuit applications and is used to connect two or more circuits together in a very compact form. It is designed to provide a very low resistance connection, and it has a high temperature range and a high-density interconnection, making it ideal for applications where space is at a premium and where highly reliable signals must be transmitted.

The specific data is subject to PDF, and the above content is for reference

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