Allicdata Part #: | QFS-064-01-SL-D-RA-ND |
Manufacturer Part#: |
QFS-064-01-SL-D-RA |
Price: | $ 11.17 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | QFS .635MM STRIPS |
More Detail: | 128 Position Connector Receptacle, Center Strip Co... |
DataSheet: | QFS-064-01-SL-D-RA Datasheet/PDF |
Quantity: | 1000 |
200 +: | $ 10.15080 |
Series: | Power Q2™ QFS |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Receptacle, Center Strip Contacts |
Number of Positions: | 128 |
Pitch: | 0.025" (0.64mm) |
Number of Rows: | 2 |
Mounting Type: | Surface Mount, Right Angle |
Features: | Ground Bus (Plane) |
Contact Finish: | Gold |
Contact Finish Thickness: | 10.0µin (0.25µm) |
Mated Stacking Heights: | -- |
Height Above Board: | -- |
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The QFS-064-01-SL-D-RA is a type of rectangular connector array, edge type, mezzanine (board to board) device. It consists of two boards, the host board and the device board, that interconnect with each other, and a row of edge contacts on the mezzanine connector that create the electrical connection between the two. This product is typically used in high-speed and high-density applications, such as networking, telecom, industrial, and embedded systems.
The device board has a top surface, which is populated with a series of edge contacts or leads. Each contact is arranged along the board’s edge, and is separated from the associated contact leads on the host board by a gap. In order to bridge the gap and make the electrical connection between the edge contacts, a conductive material, such as gold or silver, is deposited between the contacts and the leads on the host board.
The gap between the edge contacts and the host board increases the system’s signal integrity by reducing signal reflections. By minimizing the gap, the device can also reduce insertion losses and mechanical stress on the board due to temperature expansion and contraction. Additionally, the contacts can be encased in an insulative material, which further reduces signal reflections and improves isolation between adjacent lead traces.
The electrical connections are made at high speeds, and to maximize signal integrity, data can be transmitted over the surface mount PCBs without the need for package-level socketing. This can help reduce the cost and complexity of the system design, as well as reduce electromagnetic interference (EMI) due to the lack of external connectors.
The QFS-064-01-SL-D-RA connector is available with a range of impedance control options, which help maintain the desired signal integrity. Additionally, the device can be outfitted with a variety of pin configurations, as well as various contact lengths to fit a variety of space constraints. It utilizes an enhanced micro-component technology, which helps reduce the overall system size and improve performance.
The QFS-064-01-SL-D-RA connector is designed for use in high-density applications. It delivers superior signal integrity and reliability, as well as EMI shielding, and is ideal for environments with high-frequency signals. Additionally, its small size and low cost make it an attractive choice for a variety of applications, such as for networking, telecom, industrial, and embedded systems.
The specific data is subject to PDF, and the above content is for reference
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