QFS-064-04.25-H-D-DP-A-GP-P

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The QFS-064-04.25-H-D-DP-A-GP-P rectangular connector array, edge type, mezzanine (board to board) is a power-capable connector designed for board-to-board connections in high-speed networking applications. It utilizes two separate connectors to provide a high-speed data path between two printed circuit boards (PCBs). This type of connector assembly is typically used to connect boards in clusters, multiple server blades, and other multi-node products used in communication and computing applications.

The QFS-064-04.25-H-D-DP-A-GP-P is a high-speed edge-mounted device, featuring a robust interface and mechanical reliability. The connector employs two stamps – (1) a high-density terminal matrix which ensures high signal integrity, and (2) a high-powered edge loops to deliver required power. This enables the connector to handle up to four data lanes along with high power. The coupling of these two stamps allows the connector to be easily inserted and removed, while offering robust and reliable performance.

The power delivered through the QFS-064-04.25-H-D-DP-A-GP-P connector is handled over a pair of sockets in order to provide adequate power for the board. This power-capable high-speed edge-mounted device employs a robust and reliable design that is suitable for ultra-dense mezzanine-style applications. The total insertion force required to connect the two PC boards varies with the board stack up height to ensure satisfactory connection repeatability. The connector is designed to keep mechanical tolerances to a minimum in order to ensure signal integrity and reliable communication.

The electrical and mechanical aspects of the QFS-064-04.25-H-D-DP-A-GP-P connector are designed to have the utmost functionality and performance. The connector has an industry-standard electrical interface with compliance to IEC-60945, EN-60950, and EN-60601-2-21. It is also compliant with RoHS 2.0 and UL standards. The connector incorporates two SMT (surface-mounted technologies) PCB terminals to provide the highest level of signal integrity, and is rated for up to 12A of current.

QFS-064-04.25-H-D-DP-A-GP-P connectors have been designed to be used for parallel signal enhancements with minimal crosstalk and signal distortion during transmission. The high-density terminal design implementation minimizes crosstalk between signal lines. This connector is ideal for ultra-dense mezzanine-style applications because of its inherently small form-factor and its ability to handle higher current voltages.

In summary, the QFS-064-04.25-H-D-DP-A-GP-P connector is ideally suited for networking and computing applications where high-speed communications and power capabilities are required. The connector incorporates two SMT PCB terminals along with high-power edge loops to deliver adequate power. It is designed to handle up to four data lanes and is compliant with IEC-60945, EN-60950, and EN-60601-2-21 standards. The connector is suitable for use in ultra-dense mezzanine-style applications because of its small form-factor and robust design.

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