QFS-078-04.25-L-D-PC4-P

Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) is a family of products that include connectors for board-level electronic components, such as memory, processor, bus, FPGA, and various other connectors. This type of connector facilitates installation of various boards on an array of boards, and hence, increases device efficiency and performance. The QFS-078-04.25-L-D-PC4-P is one such product from this family, which offers a range of features, and it is used for device installation and connection in numerous applications and across a variety of industries.

The application fields of QFS-078-04.25-L-D-PC4-P include data storage, communication, automotive, industrial, consumer, and medical. It provides signal transfer between motherboards, daughterboards and mezzanine boards, facilitating connection between memory components, or among other suitably arranged components on the board. It supports a wide range of applications due to its superior signal integrity characteristics that make it suitable for high speed, high data transfer environments like those found in data centers, data-intensive manufacturing, supercomputer installations, embedded systems in government/MI, and other sensitive applications.

The working principle of QFS-078-04.25-L-D-PC4-P is based on the principle of electrical continuity. As such, the signal is transferred from one mainboard to another mainboard, daughterboard, or mezzanine, via multiple electrical contacts. The contacts are made with gold plated rectangular contacts that provide power and/or data flow between the boards. In most cases, one of the two boards will contain shielding for protection of the signals. Additionally, many of the devices in this family also provide for EMI shielding. Furthermore, the QFS-078-04.25-L-D-PC4-P has ESD protection up to 8kV.

QFS-078-04.25-L-D-PC4-P utilizes gold plated contacts to generate contact between the two boards. These contacts provide a six-sided connection between the two boards, which enables the transmission of power and/or signals between them. With EMI shielding to protect against RFI and ESD protection up to 8kV, the QFS-078-04.25-L-D-PC4-P ensures reliable, secure data transfer across all boards. The use of gold plating also offers insulation against oxidation and corrosion, making them ideal for applications in which PCBs can be exposed to harsh environments filled with dust, moisture, and other particles.

The QFS-078-04.25-L-D-PC4-P is qualified to MIL-PRF-2119-F Class C standards and is installed using the solder process. This product features a panel-length, multiple connector version, with a through-hole mounting that allows for protected and reliable connections. The contact centerline is 4.25mm, with a pitch of 0.8mm, and an insulation resistance of 1000M ohms minimum. It has a maximum current rating of 1.5A, and an operating temperature range from -55°C to + 105°C.

QFS-078-04.25-L-D-PC4-P is designed to meet a variety of applications and provides a reliable and secure means of connecting boards together. It is suitable for applications that require high-performance connections and a reliable signal transfer solution. As it is compatible with a wide range of products, it is an excellent choice for data intensive applications, or those that are prone to environmental hazards, such as dust, moisture, and extreme temperatures.