QMS-048-01-SL-D-DP-RA-MG

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) have a variety of pin-grid array (PGA) connectors, which offer increased density, increased I/O, increased bandwidth and decreased system complexity. The QMS-048-01-SL-D-DP-RA-MG application is used to interconnect mating printed circuit boards in a high-density application. This connector is designed for high-frequency and high-speed data transmission; it also offers enhanced EMI/RFI shielding capabilities.

The QMS-048-01-SL-D-DP-RA-MG application is a surface-mount connector array designed to support two-layer, edge-mount printed circuit board systems. The connector features four rows of signal pins, with 2.54mm (100mil) pitch and four rows of power contacts. The signals are arranged in a staggered, double-contact array that can support either single-ended or differential signals.

The connector is designed to mate with a high-density board-to-board interconnect system. The system includes a mid-plane (mezzanine) board which carries the signal, power and ground signals. The mezzanine board is mounted on the back surface of the main board, and mating connector arrays from both boards connect the boards together. This type of interconnect system offers efficient interconnects across a wide variety of board-to-board application needs.

The QMS-048-01-SL-D-DP-RA-MG application is designed to provide reliable, high-speed data transmission for edge-mount, two-layer PCB systems. It features surface-mount technology for easy integration with high-density boards, and is capable of supporting various signal protocols, including differential signaling and high-speed serial protocols such as PCI Express. The connector provides enhanced EMI/RFI shielding and is RoHS compliant.

The QMS-048-01-SL-D-DP-RA-MG application supports the transmission of high-speed data between two PCBs, such as in digital systems or memory modules. It also offers enhanced signal integrity through improved EMI/RFI shielding. The connectors are designed for extreme reliability in harsh operating environments, and are rated for up to 5 Gbps data transmission.

The QMS-048-01-SL-D-DP-RA-MG application also offers many advantages when compared to other board-to-board interconnect technologies. It is faster, more reliable and more cost-effective than other interconnects, and also offers increased signal integrity and EMI protection as well as space savings. This makes it an ideal solution for many board-to-board interconnect applications.

The QMS-048-01-SL-D-DP-RA-MG application is a versatile and reliable board-to-board interconnect system. It supports high-speed data transmission between two boards, and is designed for use in many applications, including digital systems, memory modules, and other high-density board-to-board connections. It is also designed to provide enhanced signal integrity and EMI/RFI shielding, and is RoHS compliant, offering many advantages over other board-to-board interconnect technologies.

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