QSE-020-01-H-D-A-RT1

Series:	Q Strip® QSE
Packaging:	Tube
Part Status:	Active
Connector Type:	Receptacle, Center Strip Contacts
Number of Positions:	40
Pitch:	0.031" (0.80mm)
Number of Rows:	2
Mounting Type:	Surface Mount
Features:	Board Guide, Ground Bus (Plane), Mounting Flange
Contact Finish:	Gold
Contact Finish Thickness:	30.0µin (0.76µm)
Mated Stacking Heights:	5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm
Height Above Board:	0.128" (3.25mm)

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IntroductionQSE-020-01-H-D-A-RT1 is classified as rectangular connectors, an array, an edge type, and mezzanine. It is a board-to-board interconnect solution built with high-speed signal transmission capability that offers optimal electrical and mechanical performance. This article discusses the application field and working principle of QSE-020-01-H-D-A-RT1.Application Field of QSE-020-01-H-D-A-RT1QSE-020-01-H-D-A-RT1 is widely used in various application fields. For example, QSE-020-01-H-D-A-RT1 is typically used in mission-critical applications such as high-speed internet, digital imaging, and robotics. In these fields, customers require reliable mechanical and electrical performance, and QSE-020-01-H-D-A-RT1 meets these requirements with ease.QSE-020-01-H-D-A-RT1 can also be used to provide interconnect solutions for industrial, automotive, and military applications as well. These applications demand high-reliability components, and the QSE-020-01-H-D-A-RT1 is well-suited for these hardware requirements.Additionally, QSE-020-01-H-D-A-RT1 is used in the fields of telecommunications, artificial intelligence, and data centers. It is also suitable for a wide range of applications in the aerospace industry.Working Principle of QSE-020-01-H-D-A-RT1QSE-020-01-H-D-A-RT1 is composed of two boards: the top board and the bottom board. The boards are arranged in an array configuration. The top board connects to the device, while the bottom board interconnects components.The top and bottom boards are made of polyimide material, which is a flame retardant and dielectric material used for better contact and electrical insulation. The top and bottom boards are bonded together with an adhesive material such as epoxy resin or polyurethane.QSE-020-01-H-D-A-RT1 features high-speed signal transmission capabilities. It uses a differential transmission method, which helps reduce the potential of errors due to interference. It also uses low-power consumption, making it an ideal solution for applications requiring low-power consumption.QSE-020-01-H-D-A-RT1 is designed for easy installation and reliable connection. It uses a latch mechanism to ensure a secure connection between the top and bottom boards. This prevents accidental disconnection that can result in lost data or connection failures. Additionally, it features zig-zag contact (ZIP), which decreases electrical noise and improves signal impedance.ConclusionQSE-020-01-H-D-A-RT1 is a robust and reliable board-to-board interconnect solution. It is a rectangular connector array, edge type, and mezzanine. It can be easily installed and is suitable for various application fields such as mission-critical applications, industrial, automotive, and military applications, telecommunications, artificial intelligence, and data centers. It works by using differential transmission and low-power consumption, and it features a latch mechanism as well as zig-zag contact (ZIP) to increase signal integrity.

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