QSS-016-01-F-D-DP-GP Allicdata Electronics
Allicdata Part #:

QSS-016-01-F-D-DP-GP-ND

Manufacturer Part#:

QSS-016-01-F-D-DP-GP

Price: $ 3.81
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .635MM DOUBLE ROW HS SOCKET ASSE
More Detail: 32 Position Connector Differential Pair Array, Fem...
DataSheet: QSS-016-01-F-D-DP-GP datasheetQSS-016-01-F-D-DP-GP Datasheet/PDF
Quantity: 1000
200 +: $ 3.45744
Stock 1000Can Ship Immediately
$ 3.81
Specifications
Series: Q Strip® QSS
Packaging: Tray 
Part Status: Active
Connector Type: Differential Pair Array, Female
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Ground Bus (Plane), Mating Guide
Contact Finish: Gold
Contact Finish Thickness: 3.00µin (0.076µm)
Mated Stacking Heights: 5mm
Height Above Board: 0.143" (3.63mm)
Description

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Connector array technology brings improved performance and reliability for board-to-board applications, making it suitable for a range of applications. The QSS-016-01-F-D-DP-GP application field and working principle is indicative of one type of solution that can be employed. This solution is a part of the rectangular connector array range, which is designed to link a printed circuit board to another printed circuit board, while providing superior electrical performance and reliable, robust connection.

The QSS-016-01-F-D-DP-GP rectangular connector array offers both stacked and edge configurations, making it suitable for a range of board-to-board applications. It is designed for dual side board connectivity, or double sided board, which means it can reliably connect the topside and underside of the boards together. This connector array typically has sixteen vertical rows, with up to sixteen conductors per row. It is supplied in a DIN-rail mountable, front-rear mountable, dual-pin format. It has surface mount technology (SMT) and ball grid array (BGA) topology.

The operation of the QSS-016-01-F-D-DP-GP offers various advantages over conventional connector solutions. Firstly, it offers improved performance in terms of electrical characteristics, such as low signal to noise ratio, crosstalk, and low insertion force, when compared to standard wire-to-board type solutions. The connector array also works at higher transfer speeds, making it suitable for such applications as audio or video transmission, allowing for increased throughput or data rates than the traditional solutions.

The robustness and reliable connection of the QSS-016-01-F-D-DP-GP also makes it ideal for a variety of applications which may require more extreme conditions. The contacts within the array are precisely positioned and are engineered to make direct contact with the application’s printed board. This ensures that mechanical stress is reduced, which in turn leads to increased durability and reduced signal interference.

The QSS-016-01-F-D-DP-GP is an excellent solution for board-to-board applications. It is designed for use in a variety of industries and applications, from automotive and automotive system applications to consumer electronics. Furthermore, its improved electrical characteristics and increased throughput make it suitable for high speed applications, and its robustness ensures a dependable connection in a range of conditions. As such, this connector array is an essential solution for those seeking an improved connection performance and reliability.

The specific data is subject to PDF, and the above content is for reference

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