QSS-016-01-L-D-DP-GP-LC

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) are composed of general purpose, low cost, and medium to low density type of plugs and sockets. One of the more popular types of connectors used in a range of applications is the QSS-016-01-L-D-DP-GP-LC series.

The QSS-016-01-L-D-DP-GP-LC series is designed with 16-pin, 1.0mm pitch, low profile, dual-port, and gold plated leads. The device has the additional advantage of extremely high-density and increased board space. This makes it ideal for today’s compact designs.

Applications for this type of connector include networking, telecommunication, and automotive computing. Possible applications include connection and signal transmission between two boards, power supply, data transmission, and signal conversion. It is also used in many consumer electronics, such as PDAs and game consoles.

This type of connector contains a total of 16 contacts, arranged in a 2 × 8 array. The QSS-016-01-L-D-DP-GP-LC features a low profile design with a low profile height of just 4.8mm (Fig. 1). Furthermore, this connector is equipped with dual-port design which allows two simultaneous connections to adjacent boards (Fig. 2).

The QSS-016-01-L-D-DP-GP-LC offers enhanced signal quality by minimizing crosstalk between channels. The gold-plating allows for reliable and robust contact performance, as the gold ensures good conductivity and oxidation resistance over a long period of time. Additionally, the connector is designed with a peak reflow temperature of 260°C for up to 10 seconds.

Another feature of this type of connector is its Small Outline IC (SOIC) compatible (Fig. 3) mounting shape. The mounting shape design allows for the connector to fit into many existing circuit board units. This is advantageous, as the connector does not require any special tools for installation.

The principle of operation of the QSS-016-01-L-D-DP-GP-LC is based on the use of an inward spring force and insulation displacement contact technology. Inward spring force is generated by the combination of two spring arms located on both sides of the contact, while insulation displacement technology is used to pierce the insulation layers and ensure a reliable connection.

As such, the combination of a low profile design, dual port design, gold plating, and SOIC-compatible mounting shape make the QSS-016-01-L-D-DP-GP-LC series of connectors an ideal component for a range of applications. This type of connector can deliver reliable and robust performance for a range of applications, such as networking, telecommunication, automotive computing, and consumer electronics.

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