QSS-048-01-H-D-DP-RA-WT-LS1

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QSS-048-01-H-D-DP-RA-WT-LS1

Application Field: QSS-048-01-H-D-DP-RA-WT-LS1 is a high-density, low profile dual PCIe and USB mezzanine in board-to-board step-down connector configuration. It is recommended for use in applications such as multi-gigabit and data storage systems, high speed communication, router and server applications.

Working Principle: QSS-048-01-H-D-DP-RA-WT-LS1 features a 2mm pitch and a height above board of 2.2 mm. It also has two 3.2mm staggered pins. The connector is designed to be mated with a host board that has two 2.2mm fixed pins. This design ensures contact integrity and a secure connection between the daughter board and the host board. The dual PCIe and USB mezzanine connectors are designed to meet the requirements of high speed data transmission, with up to 8Gb/s of bandwidth per lane. The connectors have a low power consumption and maintain the signal integrity of a wide variety of signals.

QSS-048-01-H-D-DP-RA-WT-LS1 connectors are constructed with a durable and reliable ZIF insulator material that is engineered to resist shock and vibration. The series of mezzanine connector come in multiple sizes, including but not limited to 52-pin, 58-pin, 68-pin, 84-pin and 100-pin. The connectors are designed in such a way that the interface between the board and the daughter board can be easily replaced.

In addition to the traditional mezzanine connector, the QSS-048-01-H-D-DP-RA-WT-LS1 range has numerous innovative features to support today’s advanced applications. These features include an optional IDC (Insulation Displacement Connector), an optional Built-In Ground Feature and Vertical Stacking Technology. The optional IDC allows for high speed transmission and easy installation, while the optional Built-In Ground Feature maximizes signal integrity across the interface. The Vertical Stacking Technology allows for height savings and improved airflow, without compromising performance and reliability.

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