QTE-040-01-L-D-A-L-TR

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The QTE-040-01-L-D-A-L-TR rectangular connector array, edge type, mezzanine (board-to-board) application field and working principles focuses on electrical connections between two circuit boards— usually printed circuit boards. The mezzanine connector facilitates the connection of two different circuit boards using a single interface. This type of solution creates a stronger bond between two boards than the traditional method of soldering, with fewer breakpoints.

The key components in the QTE-040-01-L-D-A-L-TR rectangular connector array are the spring contacts. These spring contacts, also known as pins, are bent and held precisely in position using a piece of molded plastic. The pins have a slight pre-load, which allows them to remain in contact at all times, even if the circuit boards are exposed to painful vibrations or heavy mechanical shock. Connectors designed with spring contacts feature high-density spacing, allowing more contacts to be fitted in a smaller space.

The edge type, mezzanine connector is also designed with insulation displacement contact (IDC) technology, which is used to ensure reliable electrical connection and durability. IDC is an integral part of the connector and cannot be removed easily. This feature makes it an ideal choice for applications requiring a secure mating interface, since it requires multiple pins to be engaged to connect to the host board. IDC technology also helps to reduce crosstalk and interference between two boards.

In addition to the IDC technology, the QTE-040-01-L-D-A-L-TR connector features a stackable design, which helps make assembly and maintenance easier. It has a two-layer structure that allows the top layer of contacts to be easily replaced and removed. This design also provides efficient thermal cooling and improved signal integrity. Furthermore, the connector is also designed with multiple mounting holes so that it can easily be integrated into a circuit board assembly.

The QTE-040-01-L-D-A-L-TR edge type, mezzanine connector application field and working principles make it suitable for use in a wide range of applications, such as computer motherboards, communication equipment, and industrial automation. It can also be used in medical devices, aerospace systems, and high-speed networks. With its miniaturized size and high performance, it is an ideal choice for space-constrained applications.

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