QTH-030-09-L-D-A

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The QTH-030-09-L-D-A is an electronic component that falls into the Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) category. Specifically, it is a high-density edge card mezzanine connector offering both vertical and horizontal mating, as well as a low profile. This type of connector is designed to provide an effective interconnection between boards, including PCI boards, with minimal PCB space demands. It features a robust mechanical structure and superior electrical characteristics.

The QTH-030-09-L-D-A’s application field is best suited for applications that require high board-to-board interfacing such as game consoles, medical equipment, or military and communication systems. It is capable of high-speed data transmission, supporting a wide range of protocols including Ethernet, USB, and SATA. It is also ideal for applications with rigorous signal integrity requirements due to its robust mechanical and electrical integrity.

In terms of its working principle, the QTH-030-09-L-D-A utilizes a standard signal contact which ensures consistent electrical connections between devices. The contact is constructed from a resilient metal alloy thatprovides superior contacts. It is also manufactured to meet a set of predetermined quality standards based on the industry standard IPC-A-610. The contact is then inserted into a robust housing structure which provides a secure mechanical connection between connectors.

The QTH-030-09-L-D-A also provides a number of advanced features, including a low profile design which allows for greater flexibility and reduced risk of shorting. It also employs a number of different termination methods depending on the type of application, including soldered tails and press-fit technology. Finally, it is also capable of providing high-speed, low-power signal transmission thanks to its advanced signal contact technology.

Overall, the QTH-030-09-L-D-A is an excellent choice for applications demanding high-density board-to-board electrical and mechanical interconnectivity. Its low profile design, robust mechanical and electrical contact integrity, and wide range of termination methods make it a perfect choice for high-density applications. Not to mention, its advanced signal contact technology and suite of additional features ensure consistent, reliable signal transmission.

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