RDK-SFP+-COPPER02 Allicdata Electronics
Allicdata Part #:

RDK-SFP+-COPPER02-ND

Manufacturer Part#:

RDK-SFP+-COPPER02

Price: $ 427.69
Product Category:

Development Boards, Kits, Programmers

Manufacturer: Semtech Corporation
Short Description: KIT SFP+ COPPER 10GBPS 12N 24AWG
More Detail: Clock and Data Recovery (CDR) Timing Evaluation Bo...
DataSheet: RDK-SFP+-COPPER02 datasheetRDK-SFP+-COPPER02 Datasheet/PDF
Quantity: 1000
1 +: $ 384.91700
Stock 1000Can Ship Immediately
$ 427.69
Specifications
Series: --
Part Status: Active
Type: Timing
Function: Clock and Data Recovery (CDR)
Embedded: --
Utilized IC / Part: --
Primary Attributes: --
Supplied Contents: Board(s)
Secondary Attributes: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

With the development of technology, the various application fields of Evaluation and Demonstration Boards and Kits are increasing. RDK-SFP+-COPPER02 is one of them. RDK-SFP+-COPPER02 is a complex and highly integrated board and kit. In this article, we will discuss its application field and working principle in detail.

Initially, RDK-SFP+-COPPER02 was developed as an evaluation board and kit for copper SFP+ applications. It has been mainly used in the data center and enterprise networks for 10G Ethernet and Fibre Channel applications. It supports IEEE 802.3an 10GBASE-T, as well as the SGMII and 1000BASE-X standards.

RDK-SFP+-COPPER02 consists of three layers: an Outer Layer, a Composite Layer, and an inner Layer. The Outer Layer encapsulates the entire board and can be made from a variety of materials, including plastic or aluminum. The Composite Layer is designed to protect the inner layers of copper and other materials from damage due to external forces and temperature variations. The inner layer houses the copper and has a number of components such as the transceiver, a PLL VCXO, serializers, and de-serializer.

RDK-SFP+-COPPER02 uses a unique inter-connect system, known as a “direct-connect”, which provides high-speed levels of data transfer. This allows the board to transfer data over a distance of up to 15 meters with the use of Cat 6 or Cat 7 cabling. Additionally, this board is also able to support a wide range of data transfer speeds, from 1Gbps to 10Gbps. That means RDK-SFP+-COPPER02 can be used in environments where high-speed data transfer is necessary.

The working principle of RDK-SFP+-COPPER02 is based on the principle of electrical interaction between two optical signals. The electrical signals are converted into an optical signal and then sent out to the other component. The signal is then received and converted back into an electrical signal which is then sent back to the transmitter. This allows for high-speed data transfer between the two components.

In addition to its application in data centers and enterprise networks, RDK-SFP+-COPPER02 has also been adapted for use in consumer electronics. It can be found in Blu-Ray players, digital TVs, and digital media players, enabling faster streaming of data. This board can also be used in surveillance applications, allowing for the capture and transmission of images and videos at high speeds. RDK-SFP+-COPPER02 is also used in medical device applications, providing reliable data transfer for imaging and diagnostics.

The RDK-SFP+-COPPER02 board is a complex and highly integrated Evaluation and Demonstration Board and Kits. It is mainly used in Ethernet and Fibre Channel applications, with additional applications in consumer electronics, surveillance, and medicine. It is designed to provide high-speed data transfer up to 10Gbps and utilizes a unique “direct-connect” system for driving data over longer distances. The working principle of RDK-SFP+-COPPER02 is based on the conversion of electrical signals to optical signals and back again.

The specific data is subject to PDF, and the above content is for reference

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