RDK-SFP+-COPPER05

Evaluation and Demonstration Boards and Kits:

RDK-SFP+-COPPER05 is a reference design board and kit which features evaluation and demonstration of SFP+ integrated copper cable assemblies. It consists of two independent boards, one containing high-speed channels with onboard SFP+ modules, resistance and capacitance contributions, and the other containing SFP+ reference-design connectors and cable assemblies. This evaluation and demonstration board and kit provides users with advanced features and capabilities such as signalling, control, data rate selection, operating temperature range and support for multi-mode optical transceivers.

The main goal of RDK-SFP+-COPPER05 is to allow users to evaluate their SFP+ copper solutions within the same design and with the same board. This includes power reduction, reduced component count, improved signal integrity and flexibility of the board layout.

The RDK-SFP+-COPPER05 board and kit consists of two independent boards with SFP+ modules. One of the boards contains a high-speed channel evaluation board with data rates of up to 10 Gbps, while the other is a SFP+ reference-design stack-up board. The first board is used to evaluate the performance of SFP+ modules using resistors and capacitors as interconnect components; the second board is used to assess the features and requirements of SFP+ copper cable assemblies that contain components such as connectors, contacts, flexible cables and other interconnects.

When the two boards are connected, the SFP+ modules on the first board are connected to the reference-design stack-up board, with the data and control signals being carried through the connectors and interconnects on the board. The stack-up board also contains components that can be used to adjust the data rate and other parameters of the SFP+ modules. This allows users to evaluate different copper solutions for their SFP+ applications.

The RDK-SFP+-COPPER05 board and kit is an all-encompassing solution for evaluating SFP+ copper solutions. It is designed to provide an easy-to-use platform for evaluating, testing and demonstrating SFP+ copper cabling solutions. The RDK-SFP+-COPPER05 board and kit also provide users with detailed analysis of signal integrity and measurements of loss in different data rates, enabling users to tune and optimize their designs for maximum performance.

In conclusion, the RDK-SFP+-COPPER05 board and kit is an ideal solution for evaluating a range of copper solutions for SFP+ applications. It provides users with a simple-to-use platform to evaluate their designs and provides them with detailed analysis and measurements of performance.