SEAF-30-01-L-06-2-RA

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The SEAF-30-01-L-06-2-RA is an edge type rectangular connector mezzanine from the Arrays family and is designed for board to board applications. It is an interconnect device that provides a bypass solution that because it does not require space on the printed circuit board for the receiver socket. The SEAF-30-01-L-06-2-RA is integrated with a push/ pull latching device that attaches the two boards and helps protect against contact, dust, and other debris. It also provides enhanced electrical performance, as it raises and lowers the power and ground planes between the boards. The SEAF-30-01-L-06-2-RA is compliant with RoHS, UL, and CSA standards, making it an optimal solution for high-end applications.

A major feature of the SEAF-30-01-L-06-2-RA is its stacked contact system. This system combines standard pin contacts with staggered lengths on the contact array. This contact array allows for reliable signal transfers, without the risk of short-circuiting due to the contact\'s stacked structures. The SEAF-30-01-L-06-2-RA also has low profile contact blocks that combined with the low profile mounting and makes the SEAF-30-01-L-06-2-RA suitable for smaller boards where space is at a premium. This edge type design also illustrates the optimal performance levels by making sure that all contacts appear on the edge of the board, providing easier access for soldering.

The SEAF-30-01-L-06-2-RA is designed to perform at a wide range of operating temperatures. With its extended temperature range, it can be used in any environment and can handle high temperatures up to 85°C. This design also helps reduce electromigration, making it an ideal choice for high-temperature applications. Furthermore, it offers excellent repeatability and durability thanks to its robust structure and multiple contact blocks that are able to stand up to extreme conditions.

The SEAF-30-01-L-06-2-RA is also optimised for high-speed applications, thanks to its reduced contact-to-contact spacing and its ability to transfer signals at speeds up to 6 Gbps. It is also designed to be low in capacitance and inductance, allowing signals to travel longer distances without losing integrity. The SEAF-30-01-L-06-2-RA is also reverse compatible, allowing for compatibility with existing boards.

Overall, the SEAF-30-01-L-06-2-RA is an extremely versatile component that can perform in board-to-board connectors in a variety of applications. Its wide temperature range, low profile design, and excellent signal transfer performance make it an optimal choice for any board-to-board solution. With its stacked contact system and low inductance, it is a reliable and durable choice for any high-end board-to-board application. The SEAF-30-01-L-06-2-RA is a great solution for many board-to-board applications.

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