SEAF-30-07.5-L-04-2-A-K-TR

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The SEAF-30-07.5-L-04-2-A-K-TR belongs to a family of Edge Type Rectangular Connectors that are mainly used as Mezzanine Board to Board interfaces. These connectors allow for a flexible, fast, low-cost system-level integration as well as interconnect capabilities between dissimilar components such as multilayer boards, transceivers, and cable harnesses. This is why they are developed to meet the highest standards in terms of reliability, quality and cost-effectiveness.

The SEAF-30-07.5-L-04-2-A-K-TR rectangular connector offers two important features: first, it provides a secure, reliable mating system to ensure a secure connection, and second, it has a low profile design, which reduces its assembly footprint and makes it easier to integrate with other board-level components.

This connector is designed to meet the various requirements of scientific, industrial, military, aerospace, and medical applications. It is made from high-temperature insulation materials, which ensure high heat dissipation, and is also available in a surface mount version. This allows for low-profile applications and a space-saving solution.

The SEAF-30-07.5-L-04-2-A-K-TR incorporates two separate layers: a contact layer and a body layer. The body layer is made from high-temperature material and is designed to dissipate heat, while the contact layer is made from tin-plated copper alloy and is designed to provide reliable electrical contact. This connector offers a contact pitch of 0.75 mm, which allows for a higher density connection.

The working principle of the SEAF-30-07.5-L-04-2-A-K-TR lies mainly in its design. As mentioned above, it has two components: the body layer and the contact layer. When the two layers are mated, they create a secure connection that provides reliable electrical contact. The tin-plated copper alloy contact surface creates a reliable surface-to-surface contact that is important for minimizing metallic losses and providing an efficient transfer of high-speed signals.

The contact pitch of 0.75 mm allows for higher density connections and improved electrical performance over other connectors. The use of high-temperature insulation materials ensures a secure connection, even in extreme temperatures. The low-profile design reduces the assembly footprint and allows for easy integration with board-level components.

The SEAF-30-07.5-L-04-2-A-K-TR is a reliable, fast, and low-cost solution for interconnecting systems and various board-level components. Its high-temperature insulation materials and its contact pitch of 0.75 mm allow for a secure connection and higher density connections. This connector is designed for various applications within the scientific, industrial, military, aerospace, and medical fields, and it is available in a surface mount version, making it a flexible solution for a variety of applications.

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