SEM-130-02-03.0-H-D-A Allicdata Electronics
Allicdata Part #:

SAM12820-ND

Manufacturer Part#:

SEM-130-02-03.0-H-D-A

Price: $ 8.32
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .8MM TIGER EYE MICRO SOCKET
More Detail: 60 Position Receptacle Connector Surface Mount
DataSheet: SEM-130-02-03.0-H-D-A datasheetSEM-130-02-03.0-H-D-A Datasheet/PDF
Quantity: 64
1 +: $ 7.56000
10 +: $ 7.30800
25 +: $ 7.05600
50 +: $ 6.80400
100 +: $ 6.55200
250 +: $ 6.42600
500 +: $ 6.30000
1000 +: $ 6.04800
Stock 64Can Ship Immediately
$ 8.32
Specifications
Insulation Color: Black
Contact Finish Thickness - Post: Flash
Contact Material: Beryllium Copper
Contact Shape: Square
Insulation Material: Liquid Crystal Polymer (LCP)
Applications: --
Voltage Rating: --
Current Rating: 2.6A per Contact
Features: Board Guide
Ingress Protection: --
Mated Stacking Heights: 6mm, 7mm, 10mm
Contact Finish - Post: Gold
Material Flammability Rating: --
Operating Temperature: -55°C ~ 125°C
Contact Length - Post: --
Insulation Height: 0.177" (4.50mm)
Series: Tiger Eye™ SEM
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Fastening Type: Push-Pull
Termination: Solder
Mounting Type: Surface Mount
Row Spacing - Mating: 0.125" (3.18mm)
Number of Rows: 2
Pitch - Mating: 0.031" (0.80mm)
Number of Positions Loaded: All
Number of Positions: 60
Style: Board to Board
Contact Type: Female Socket
Connector Type: Receptacle
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

SEM-130-02-03.0-H-D-A is known as a rectangular connector that belongs to the headers, receptacles, and female sockets family. It is typically used for applications that require the transmission of signals or power in various forms across multiple segments.

SEM-130-02-03.0-H-D-A is a combination of two components, the socket and the Socket Receptacle. The Socket side is responsible for housing the male contacts that are to be connected to the PCB, while the Socket Receptacle side is responsible for housing the mating connector that connects the two board sections.

The SEM-130-02-03.0-H-D-A connector is ideal for applications that require a low-profile, high-density connector with superior electrical performance. The connector has a high-temperature insulation, providing resistance to high temperatures, making it ideal for harsh environments where thermal cycling is necessary and/or circuits require major power. The connector is also designed with a simple, robust, positive-locking system that serves to secure the connection between the two halves.

The working principle of the SEM-130-02-03.0-H-D-A connector is relatively simple. The mating process for the connector involves the insertion of the plug side into the socket side and the subsequent engagement of the positive locks, or latching. Once engaged, a connection is established between the two boards, allowing for a strong connection and signal transmission.

The SEM-130-02-03.0-H-D-A connector is most commonly used in applications such as industrial automation, military and aerospace, transportation, and medical. The connector is suitable for a wide range of solid or stranded contacts ranging from simple on/off connections to complex low-loss differential signals.

Thanks to its high-density design and robust design, the SEM-130-02-03.0-H-D-A connector can be used for applications with harsh environmental conditions, such as extreme temperatures, shock, vibration, EMI, and humidity. Moreover, the connector is suitable for applications requiring a high level of reliability, such as those in harsh automotive and space applications.

In conclusion, the SEM-130-02-03.0-H-D-A connector is a high-density, low-profile connector designed for applications requiring robust electrical performance and secure connection between two boards. While most commonly used in industrial, military, and automotive applications, the connector is suitable for a variety of applications with extreme environmental conditions.

The specific data is subject to PDF, and the above content is for reference

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