SFCIC1000224MX1

Feed Through Capacitors are widely used for many applications which require high-frequency signal transmissions. The SFCIC1000224MX1 is a type of Feed Through Capacitor designed to improve the signal transmission capability in a variety of applications. This capacitor has been designed specifically for Ultra High Frequency applications including microwave frequencies, where excellent signal integrity is required.

The SFCIC1000224MX1 has a nominal capacitance of 1000 pF in a standard package size of 18 mm x 18 mm x 4 mm and a rated frequency range of 2 – 40 GHz. It is made of a high-grade dielectric material with low dielectric losses at high frequencies. The small package makes it ideal for applications where board space is limited.

The SFCIC1000224MX1 features excellent power handling capability and high DC breakdown voltage. It is constructed with a thick film die pattern for superior electrical performance and reliability. The SFCIC1000224MX1 offers excellent RF shielding and very low levels of dissipation factor. It provides high self-resonance and very low insertion loss.

The SFCIC1000224MX1’s working principle is simple and effective. It acts as a capacitor that is connected between the two transmission lines. It passes the signal from one line to the other without inducing any interference or losses due to its very low insertion loss. This makes it an ideal choice for signal transmission in high-frequency applications.

The SFCIC1000224MX1 is designed to be used in a variety of applications including antennas, amplifiers, receivers, and other wireless communication systems. It is also suitable for signal line applications such as radio, TV, and other satellite systems. Additionally, it is perfect for medical and imaging applications as well as industrial, automotive, and even household applications.

The SFCIC1000224MX1 is a great solution for high-frequency signal transmission applications. It offers excellent power handling capability, low insertion loss, high self-resonance, and excellent RF shielding. It is available in a compact package size with thick film die pattern for superior electrical performance and reliability. It is a reliable and cost-effective choice for many high-frequency signal transmission applications.