SFM315-LPPE-D10-SM-BK

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The SFM315-LPPE-D10-SM-BK rectangular connector is a type of header, receptacle, and female socket, best used for high-density, through-hole interconnect assemblies. It features a very low profile with a height of 6.6mm, helping to reduce the vertical height of the assembly significantly. These headers are typically used in a variety of applications, such as thin hardware devices, medical devices, and gaming consoles.

This connector is compliant with the UL 94-V-0 flame retardant rating, and with the IEC 60512 grounding requirements. It also has a proven electromechanical performance with a pull out force of 15 N (require a socket box crimp tool, sold separately).

The SFM315-LPPE-D10-SM-BK features a robust and durable construction. It is made from a single piece of material, which helps to increase the overall strength of the connector. It is also designed with a robust and stylish housing that can withstand harsh industrial environments.

The SFM315-LPPE-D10-SM-BK is compatible with many other types of headers and receptacles, including: D-type, F-type and micro-miniature headers; threaded or chinned shoulder receptacles; and finger-ground-type and empty sockets. It also supports a wide variety of devices, including: • Power devices • Digital video cameras • Automotive electronics • Medical devices

The primary function of the SFM315-LPPE-D10-SM-BK is to provide an efficient transfer of electrical signals and current between two supplied terminals. This type of connector uses an internal key and pin design, allowing the components to join together. It also reduces the risk of electrical shorts or leakage. Through the use of an internal key, the connector provides additional protection against vibration, shock, and temperature changes.

The SFM315-LPPE-D10-SM-BK has an impressive track record of reliable and consistent performance. It has also been designed with cost-effectiveness in mind, making it a great choice for a wide range of applications. Ultimately, its reliable and cost-effective design makes it an excellent choice for high-density, through-hole interconnect assemblies.

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