SPHWW1HDNC25YHT2B3

LED Lighting - COBs, Engines, Modules

The acronym SPHWW1HDNC25YHT2B3 stands for “Surface-mounted Heat-transferring Waterproof High-density nano-carrier chip with 2.5 mm×2.5 mm×2B”. This type of chip is mainly used in LED lighting applications, particularly in COBs (Chip On Board), Engines and Modules.

COBs

A Chip on Board (COB) is a technology in which multiple LEDs (Light Emitting Diodes) are integrated onto a single substrate. It is usually a powerful package containing both the circuitry and the LEDs, mounted onto a printed circuit board (PCB). This is used to reduce the overall form factor of the device, while increasing the brightness of the LED light output. With a COB, the LEDs are directly connected to the PCB, making it easy to heat sink the heat generated by the LEDs.

The SPHWW1HDNC25YHT2B3 chip is highly-suitable for LED lighting applications, such as in COB LED lights, as it solves two major problems faced when using conventional LED lights – power-saving and heat dissipation. It is a thermal conveyer chip with a series of tightly-arranged cooling fins that improves the heat sink performance and eventually increases the lifespan of the LEDs.

Engines and Modules

The SPHWW1HDNC25YHT2B3 chip is also popularly used in LED lighting Engine and Module applications. LED lighting Engines are composed of LED driver and LED chips, while LED lighting Modules are composed of LED chips and LED heatsinks. These devices have special requirements in terms of size and power, as they need a thin, lightweight and sometimes portable form factor in order to accommodate and produce enough power for the LEDs to achieve the desired lighting effect.

The SPHWW1HDNC25YHT2B3 chip is OSRAM’s “thinnest but strongest” chip, allowing it to integrate seamlessly into LED lighting applications, such as Engines and Modules. It utilizes advanced heat transfer technology to regulate the amount of heat dissipated from the LEDs, allowing for a compact and lightweight package that is still able to produce a consistent and bright light output.

Working Principle

The working principle of the SPHWW1HDNC25YHT2B3 chip is based on the principle of Forced convection. This type of convection is useful in systems with high heat output, and is also preferred over natural convection, as it is more efficient and improves the heat dissipation process.

The chip is made up of an array of closely-arranged fins that act as a heat sink. Each fin has a dielectric powder coating on it, which is responsible for transferring the generated heat from the LED chip to the fins. The fins then act as a heat sink, dissipating the heat away from the LED chip and dispersing it into the surrounding air.

The SPHWW1HDNC25YHT2B3 chip is also equipped with an advanced thermal protection circuit, which helps to regulate the temperature of the heat sink, preventing it from getting too hot. This ensures that the chip is operating safely and prevents the LEDs from getting damaged due to excessive heat.

The SPHWW1HDNC25YHT2B3 chip is a highly effective and efficient chip, which makes it a great choice for LED lighting applications such as COBs, Engines and Modules. With its advanced thermal protection circuit, it ensures safe and reliable operation, while its heat-transferring fins allow for a thinner and lighter package that still produces a bright, consistent light output.