SSQ-110-02-F-D-LL Allicdata Electronics
Allicdata Part #:

SSQ-110-02-F-D-LL-ND

Manufacturer Part#:

SSQ-110-02-F-D-LL

Price: $ 1.92
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: 2MM SOCKET STRIPS
More Detail: 20 Position Receptacle Connector Through Hole
DataSheet: SSQ-110-02-F-D-LL datasheetSSQ-110-02-F-D-LL Datasheet/PDF
Quantity: 1000
1 +: $ 1.73880
Stock 1000Can Ship Immediately
$ 1.92
Specifications
Insulation Color: Black
Contact Finish Thickness - Post: --
Contact Material: Phosphor Bronze
Contact Shape: Square
Insulation Material: Liquid Crystal Polymer (LCP)
Applications: --
Voltage Rating: 550VAC
Current Rating: 6.3A per Contact
Features: --
Ingress Protection: --
Mated Stacking Heights: --
Contact Finish - Post: Tin
Material Flammability Rating: UL94 V-0
Operating Temperature: -55°C ~ 125°C
Contact Length - Post: 0.194" (4.93mm)
Insulation Height: 0.335" (8.51mm)
Series: SSQ
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Fastening Type: Push-Pull
Termination: Press-Fit, Solder
Mounting Type: Through Hole
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Pitch - Mating: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 20
Style: Board to Board or Cable
Contact Type: Forked
Connector Type: Receptacle
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The SSQ-110-02-F-D-LL is part of the rectangular connector family and is a type of header, receptacle, female socket. This type of rectangular connector is used for applications that require a certain level of electrical connectivity without compromising the product’s properties.

The SSQ-110-02-F-D-LL is a high-quality product with two rows of two-level straight pins. These pins are arranged on the base at a distance of 0.1 inch apart, leading to the overall size of the product. Even though the overall size is small, the performance of the device is top of the class with excellent signal integrity, high isolation, and reliable connection. Moreover, the SSQ-110-02-F-D-LL has a high impact rating making it suitable for both stationary and mobile applications.

The SSQ-110-02-F-D-LL has various applications. It is used in motor drive modules, automotive systems, medical equipment, air conditioning systems, and in the communication industry. By virtue of its performance capabilities, the device is well-suited for usage in mission-critical applications.

The primary working principle of the SSQ-110-02-F-D-LL is based on the principle of contact displacement. The contact displacement principle works based on the interaction between a stationary contact and moving contact. The stationary contact consists of pins fixed in place inside the receptacle and the moving contact consists of pins mounted on the header.

When the header is inserted into the receptacle, several of these pins come in contact with the surface of the stationary contact. As the header is pushed further in, the moving contact forces the stationary contact and moves it away from the pins. This movement of the contacts results in displacement of two of the pins from the surface of the stationary contacts. This displacement creates a gap between them, and this gap is what provides the electrical connection. Additionally, when the header is removed from the receptacle, the pins move to their original position, breaking the electrical connection.

The SSQ-110-02-F-D-LL offers an advanced level of electrical connectivity. It has a voltage rating of 48 Vdc maximum and current rating of 1A per contact. The device is also dust-proof, dirt-proof, and moisture-proof making it well-suited for different environments such as a damp or dusty working environment.

The SSQ-110-02-F-D-LL is a high-performance connector made of materials such as steel, Delrin, and Polycarbonate. It has a low profile making it ideal for space-constrained equipment. The device is also designed for secure connections and easy data portability and is an ideal choice for applications that require a high level of reliability without compromising the compact size.

The specific data is subject to PDF, and the above content is for reference

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