TCSD-20-D-24.00-01-P01

Rectangular cable assemblies are a popular form of cabling used for a variety of applications. The TCSD-20-D-24.00-01-P01 is one of the rectangular cable assemblies used in high-speed digital communication systems. This type of assembly provides improved reliability, signal integrity and scalability, while simultaneously supporting higher bandwidth.

Application Field

The TCSD-20-D-24.00-01-P01 assembly is widely used for many applications, particularly in high-speed digital communication systems. It has been used in the fields such as telecommunications, medical imaging, and avionics. It can also be employed in the automotive industry for transmission of data, and in industrial automation equipment.

The TCSD-20-D-24.00-01-P01 cable assembly is designed to provide high-speed data rates over long distances. It is capable of transmitting data up to 24 Gbps, making it suitable for a variety of applications. This type of cable assembly can also be used in areas with high temperatures, due to its ability to withstand temperatures ranging from -40 to +125 °C.

Working Principle

The TCSD-20-D-24.00-01-P01 cable assembly uses a ribless design to provide a low-loss path for electrical signals. The assembly is composed of several components, including an inner dielectric layer, an outer dielectric layer, and a grounded EMI shield. The inner dielectric layer consists of a polytetrafluoroethylene (PTFE) core, which is surrounded by an inner dielectric layer composed of a cross-linked polyethylene (XLPE) material.

The outer dielectric layer is made of a fluoropolymer material that provides excellent electrical protection and insulates the wire, reducing the electrical leakage. The XLPE and PTFE materials are combined to provide superior flexibility and signal integrity. Lastly, an EMI shield is included to prevent electromagnetic interference from affecting the signal.

This TCSD-20-D-24.00-01-P01 cable assembly provides reliable data transmission through its low-loss design. It is capable of transmitting data at speeds up to 24 Gbps and operating in temperatures from -40 to +125 °C. This makes it ideal for a wide variety of applications in high-speed digital communication systems.